Invention Grant
US06713313B2 Field emission arrays and method of fabricating emitter tips and corresponding resistors thereof with a single mask
失效
场致发射阵列和用单个掩模制造发射极尖端及其对应的电阻器的方法
- Patent Title: Field emission arrays and method of fabricating emitter tips and corresponding resistors thereof with a single mask
- Patent Title (中): 场致发射阵列和用单个掩模制造发射极尖端及其对应的电阻器的方法
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Application No.: US10144490Application Date: 2002-05-13
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Publication No.: US06713313B2Publication Date: 2004-03-30
- Inventor: Ammar Derraa
- Applicant: Ammar Derraa
- Main IPC: H01L2100
- IPC: H01L2100

Abstract:
A method for fabricating field emission arrays employs a single mask to define emitter tips, their corresponding resistors, and, optionally, conductive lines. One or more material layers from which the emitter tips and resistors will be defined are formed over and laterally adjacent substantially parallel conductive lines. The exposed surface of the layer or layers of emitter tip and resistor material or materials may be planarized. The emitter tips and underlying resistors are then defined. Substantially longitudinal center portions of the conductive lines may be exposed between adjacent lines of emitter tips, with at least a lateral edge portion of each conductive line being shielded by material that remains following the formation of the emitter tips and resistors. The exposed portions of the conductive lines may be removed in order to define conductive traces. Field emission arrays and display devices fabricated by such methods are also disclosed.
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