发明授权
- 专利标题： Phenyl, naphthly or fluorene cyclopentyl epoxy resins
- 专利标题（中）： 苯基，萘或芴环戊基环氧树脂
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申请号： US09986630申请日： 2001-11-09
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公开(公告)号： US06713589B2公开(公告)日： 2004-03-30
- 发明人: Haruaki Sue , Shinsuke Hagiwara , Fumio Furusawa , Seiichi Akagi , Akihiro Kobayashi , Hideki Yokoyama
- 申请人： Haruaki Sue , Shinsuke Hagiwara , Fumio Furusawa , Seiichi Akagi , Akihiro Kobayashi , Hideki Yokoyama
- 优先权： JP08-320118 19961129; JP09-043512 19970227; JPPCT/JP97/04373 19971201
- 主分类号： C07D30128
- IPC分类号： C07D30128
摘要：
This invention provides a compound suitable as an encapsulating material for electronic devices and having a high Tg, low moisture-absorption, high adhesion and fluidity which is a cyclopentylene compound represented by Formula (I) and its intermediate cyclopentenyl compound represented by Formula (III). In the formula, m is 0 or more, Ar1 and Ar2 are each a phenol residual group, a naphthol residual group or a fluorene derivative residual group, and each contain a hydroxyl group or a glycidyloxyl group.
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