公开(公告)号：US07544727B2

公开(公告)日：2009-06-09

申请号：US11260463

申请日：2005-10-28

申请人： Ryoichi Ikezawa ,  Masanobu Fujii ,  Shinsuke Hagiwara

发明人： Ryoichi Ikezawa ,  Masanobu Fujii ,  Shinsuke Hagiwara

IPC分类号： C08K3/36 ,  C08K7/18 ,  C08L61/08 ,  C08L61/12 ,  C08L63/02 ,  C08L63/04 ,  H01L21/56 ,  H01L23/29

CPC分类号： H01L23/293 ,  C08K5/521 ,  C08K5/5455 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  Y10T428/31511 ,  C08L63/00 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An encapsulating epoxy resin molding material comprising (A) an epoxy resin, (B) a curing agent, and (C) a silane coupling agent having a secondary amino group or (D) a phosphate, and semiconductor devices encapsulated therein.The encapsulating epoxy resin molding material for thin semiconductor devices according to this invention is excellent in fluidity, and the semiconductor device encapsulated therein, which is a semiconductor device having a semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or on a mounted substrate such as organic substrate or organic film, is free of molding defects such as wire sweep, voids etc. as shown in the Examples, and thus its industrial value is significant.

摘要翻译： 一种包封环氧树脂成型材料，其包含（A）环氧树脂，（B）固化剂和（C）具有仲氨基或（D）磷酸酯的硅烷偶联剂以及封装在其中的半导体器件。 根据本发明的用于薄半导体器件的封装环氧树脂模制材料具有优异的流动性，并且封装在其中的半导体器件是半导体器件，半导体器件具有布置在薄的多引脚长线，窄焊盘 或者在有机基板或有机膜等的安装基板上，如实施例所示，没有成型缺陷，例如电线扫描，空隙等，因此其工业价值是显着的。

公开(公告)号：US20060074150A1

公开(公告)日：2006-04-06

申请号：US11260463

申请日：2005-10-28

申请人： Ryoichi Ikezawa ,  Masanobu Fujii ,  Shinsuke Hagiwara

发明人： Ryoichi Ikezawa ,  Masanobu Fujii ,  Shinsuke Hagiwara

IPC分类号： C08L63/00 ,  H01L21/56 ,  B32B27/38

CPC分类号： H01L23/293 ,  C08K5/521 ,  C08K5/5455 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  Y10T428/31511 ,  C08L63/00 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An encapsulating epoxy resin molding material comprising (A) an epoxy resin, (B) a curing agent, and (C) a silane coupling agent having a secondary amino group or (D) a phosphate, and semiconductor devices encapsulated therein. The encapsulating epoxy resin molding material for thin semiconductor devices according to this invention is excellent in fluidity, and the semiconductor device encapsulated therein, which is a semiconductor device having a semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or on a mounted substrate such as organic substrate or organic film, is free of molding defects such as wire sweep, voids etc. as shown in the Examples, and thus its industrial value is significant.

摘要翻译： 一种包封环氧树脂成型材料，其包含（A）环氧树脂，（B）固化剂和（C）具有仲氨基或（D）磷酸酯的硅烷偶联剂和封装在其中的半导体器件。 根据本发明的用于薄半导体器件的封装环氧树脂模制材料具有优异的流动性，并且封装在其中的半导体器件是半导体器件，半导体器件具有布置在薄的多引脚长线，窄焊盘 或者在有机基板或有机膜等的安装基板上，如实施例所示，没有成型缺陷，例如电线扫描，空隙等，因此其工业价值是显着的。

公开(公告)号：US06713589B2

公开(公告)日：2004-03-30

申请号：US09986630

申请日：2001-11-09

申请人： Haruaki Sue ,  Shinsuke Hagiwara ,  Fumio Furusawa ,  Seiichi Akagi ,  Akihiro Kobayashi ,  Hideki Yokoyama

发明人： Haruaki Sue ,  Shinsuke Hagiwara ,  Fumio Furusawa ,  Seiichi Akagi ,  Akihiro Kobayashi ,  Hideki Yokoyama

IPC分类号： C07D30128

CPC分类号： C08G59/3218 ,  C07C39/17 ,  C07C2601/08 ,  C08G59/24 ,  C08L63/00 ,  H01L23/293 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1301 ,  H01L2924/00014 ,  H01L2924/00

摘要： This invention provides a compound suitable as an encapsulating material for electronic devices and having a high Tg, low moisture-absorption, high adhesion and fluidity which is a cyclopentylene compound represented by Formula (I) and its intermediate cyclopentenyl compound represented by Formula (III). In the formula, m is 0 or more, Ar1 and Ar2 are each a phenol residual group, a naphthol residual group or a fluorene derivative residual group, and each contain a hydroxyl group or a glycidyloxyl group.

摘要翻译： 本发明提供一种适合作为电子器件的封装材料的化合物，其具有高Tg，低吸湿性，高粘附性和流动性，它是式（I）表示的环戊烯化合物及其由式（III）表示的中间体环戊烯基化合物， 。 在该式中，m为0以上，Ar 1和Ar 2分别为酚残基，萘酚残基或芴衍生物残基，各自含有羟基或缩水甘油氧基。

公开(公告)号：US07981977B2

公开(公告)日：2011-07-19

申请号：US12096445

申请日：2006-12-08

申请人： Kazuyoshi Tendou ,  Satoru Tsuchida ,  Shinsuke Hagiwara

发明人： Kazuyoshi Tendou ,  Satoru Tsuchida ,  Shinsuke Hagiwara

IPC分类号： C08K3/36 ,  C08L63/00 ,  C08L63/02 ,  H01L23/29

CPC分类号： C08G59/063 ,  C08G59/5033 ,  C08G59/686 ,  C08L63/00 ,  C08L83/04 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/09701 ,  C08L83/00 ,  H01L2924/00

摘要： The invention relates to a liquid resin composition for electronic components which is used in sealing of electronic components, comprising a liquid epoxy resin, a curing agent containing a liquid aromatic amine, and an inorganic filler, and further comprising at least one member selected from a hardening accelerator, silicone polymer particles, and a nonionic surfactant. There is thereby provided a liquid resin composition for electronic components, which is excellent in fluidity in narrow gaps, is free of void generation, is excellent in adhesiveness and low-stress characteristic and is excellent in fillet formation, as well as an electronic component device having high reliability (moisture resistance, thermal shock resistance), which is sealed therewith.

摘要翻译： 本发明涉及一种电子部件用液体树脂组合物，其用于电子部件的密封，包括液体环氧树脂，含有液体芳香胺的固化剂和无机填料，并且还包含至少一种选自 硬化促进剂，硅氧烷聚合物颗粒和非离子表面活性剂。 由此，提供了一种电子部件用液态树脂组合物，其狭窄间隙的流动性优异，无空隙生成，粘合性和低应力特性优异，成形性优异，电子部件装置 具有高密度的可靠性（耐湿性，耐热冲击性）。

公开(公告)号：US07397139B2

公开(公告)日：2008-07-08

申请号：US10552441

申请日：2004-04-07

申请人： Ryoichi Ikezawa ,  Naoki Nara ,  Hideyuki Chaki ,  Yoshihiro Mizukami ,  Yoshinori Endou ,  Takaki Kashihara ,  Fumio Furusawa ,  Masaki Yoshii ,  Shinsuke Hagiwara ,  Mitsuo Katayose

发明人： Ryoichi Ikezawa ,  Naoki Nara ,  Hideyuki Chaki ,  Yoshihiro Mizukami ,  Yoshinori Endou ,  Takaki Kashihara ,  Fumio Furusawa ,  Masaki Yoshii ,  Shinsuke Hagiwara ,  Mitsuo Katayose

IPC分类号： H01L23/28

CPC分类号： H01L23/295 ,  H01L21/563 ,  H01L23/293 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/00 ,  H01L2224/0401

摘要： An encapsulating epoxy resin molding material, comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the inorganic filler (C) has an average particle size of 12 μm or less and a specific surface area of 3.0 m2/g or more.

摘要翻译： 一种封装环氧树脂成型材料，其包含（A）环氧树脂，（B）固化剂和（C）无机填料，其中，所述无机填料（C）的平均粒径为12μm以下， 表面积为3.0m 2 / g以上。

公开(公告)号：US06365432B1

公开(公告)日：2002-04-02

申请号：US09487682

申请日：2000-01-19

申请人： Naoki Fukutomi ,  Yoshiaki Tsubomatsu ,  Fumio Inoue ,  Toshio Yamazaki ,  Hirohito Ohhata ,  Shinsuke Hagiwara ,  Noriyuki Taguchi ,  Hiroshi Nomura

发明人： Naoki Fukutomi ,  Yoshiaki Tsubomatsu ,  Fumio Inoue ,  Toshio Yamazaki ,  Hirohito Ohhata ,  Shinsuke Hagiwara ,  Noriyuki Taguchi ,  Hiroshi Nomura

IPC分类号： H01L2144

CPC分类号： H01L21/568 ,  H01L21/4803 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/16237 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32503 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83001 ,  H01L2224/83102 ,  H01L2224/8319 ,  H01L2224/83385 ,  H01L2224/8381 ,  H01L2224/8385 ,  H01L2224/85001 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15183 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/203 ,  H01L2924/351 ,  H05K3/20 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2924/0002

摘要： A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.

公开(公告)号：US5976912A

公开(公告)日：1999-11-02

申请号：US716362

申请日：1996-09-18

申请人： Naoki Fukutomi ,  Yoshiaki Tsubomatsu ,  Fumio Inoue ,  Toshio Yamazaki ,  Hirohito Ohhata ,  Shinsuke Hagiwara ,  Noriyuki Taguchi ,  Hiroshi Nomura

发明人： Naoki Fukutomi ,  Yoshiaki Tsubomatsu ,  Fumio Inoue ,  Toshio Yamazaki ,  Hirohito Ohhata ,  Shinsuke Hagiwara ,  Noriyuki Taguchi ,  Hiroshi Nomura

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L21/58 ,  H01L21/68 ,  H01L23/31 ,  H01L23/498 ,  H05K3/20 ,  H01L23/28

CPC分类号： H01L21/568 ,  H01L21/4803 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/32 ,  H01L24/83 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/16237 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32503 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83001 ,  H01L2224/83102 ,  H01L2224/8319 ,  H01L2224/83385 ,  H01L2224/8381 ,  H01L2224/8385 ,  H01L2224/85001 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15183 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/203 ,  H01L2924/351 ,  H05K3/20

摘要： A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.

摘要翻译： PCT No.PCT / JP95 / 00492 Sec。 371日期1996年9月18日 102（e）1996年9月18日PCT PCT 1995年3月17日PCT公布。 公开号WO95 / 26047 日期1995年9月28日提供了半导体封装基板，可以满足半导体高集成化的趋势。 将镍层电镀在电镀铜箔上以形成布线图案。 将LSI芯片安装在铜箔上，通过引线接合连接LSI芯片和布线图案的端子，然后用半导体密封环氧树脂密封。 只有铜箔用碱蚀刻剂溶解掉才能暴露镍。 对于具有低铜溶力的镍剥离器，去除镍层以露出布线图案。 涂覆阻焊剂，并且以使连接端子部分露出的方式形成图案。 将焊球放置在布线图案的露出部分，然后熔合。 布线图案通过焊球与外部印刷电路板连接。

公开(公告)号：US5319005A

公开(公告)日：1994-06-07

申请号：US826512

申请日：1992-01-27

申请人： Shinsuke Hagiwara ,  Hiroyuki Kuriya ,  Shigeki Ichimura

发明人： Shinsuke Hagiwara ,  Hiroyuki Kuriya ,  Shigeki Ichimura

IPC分类号： C08G59/62 ,  C08L63/00 ,  H01L23/29

CPC分类号： H01L23/295 ,  C08G59/621 ,  C08L63/00 ,  H01L2924/0002

摘要： An epoxy resin molding material for sealing of electronic components comprising(A) an epoxy resin;(B) a phenolic compound;(C) a resin mixture obtained bydispersing, in a form of particulates, in a dispersion medium which is a portion or all of at least one of the epoxy resin and the phenolic compound, a mixture of a vinyl group-containing organopolysiloxane and a .tbd.SiH group-containing organopolysiloxane whose total volatile loss after heating at 105.degree. C. for three hours is not more than 3% by weight, and allowing the vinyl group-containing organopolysiloxane and the .tbd.SiH group-containing organopolysiloxane to react with each other and to cure; and(D) an inorganic filleris excellent in thermal shock resistance, soldering resistance, moisture resistance, thermal stability, moldability and marking properties.

摘要翻译： 一种用于密封电子部件的环氧树脂成型材料，包括（A）环氧树脂; （B）酚类化合物; （C）通过将颗粒状分散在作为环氧树脂和酚类化合物中的至少一种的一部分或全部的分散介质中的含有乙烯基的有机聚硅氧烷和 在105℃下加热3小时后的总挥发损失为3重量％以下，含有乙烯基的有机聚硅氧烷和含有3个SiH基的有机聚硅氧烷彼此反应的含SiH基的有机聚硅氧烷 治愈; 和（D）无机填料具有优异的耐热冲击性，耐焊接性，耐湿性，热稳定性，成型性和标记性。

公开(公告)号：US5206333A

公开(公告)日：1993-04-27

申请号：US879363

申请日：1992-05-07

申请人： Haruaki Sue ,  Ken Nanaumi ,  Takuji Itou ,  Ken Madarame ,  Shinsuke Hagiwara

发明人： Haruaki Sue ,  Ken Nanaumi ,  Takuji Itou ,  Ken Madarame ,  Shinsuke Hagiwara

IPC分类号： C08G8/08

CPC分类号： C08G8/08

摘要： A copolycondensation of a phenol, a naphthol and formaldehyde proceeds smoothly in the presence of an acid and a metallic element selected from the group consisting of transition metallic elements and metallic elements of Group IIa, Group IIIa, Group IVa, Group Va and Group VIa of the Periodic Table, and a naphthol-modified phenolic resin which has a large molecular weight and does not gel is obtained.

公开(公告)号：US08232355B2

公开(公告)日：2012-07-31

申请号：US12094838

申请日：2006-11-24

申请人： Hisato Takahashi ,  Hisashi Tsukahara ,  Kyouichi Tomita ,  Shinsuke Hagiwara

发明人： Hisato Takahashi ,  Hisashi Tsukahara ,  Kyouichi Tomita ,  Shinsuke Hagiwara

IPC分类号： C08F283/12 ,  C08F283/10 ,  C08G77/38 ,  C08G77/04 ,  C08L63/00 ,  C08L83/02

CPC分类号： C08G59/42 ,  C08L63/00 ,  H01L23/295 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides a liquid resin composition for electronic components, which is excellent in migration resistance and also superior in formability and reliability, as well as an electronic component device sealed therewith, and relates to a liquid resin composition for electronic components, which comprises (A) an epoxy resin, (B) a cyclic acid anhydride which is liquid at ordinary temperature and has an acid anhydride equivalent of 200 or more, and (C) a coupling agent.

摘要翻译： 本发明提供一种电迁移阻力优异，成型性和可靠性优异的电子部件用液态树脂组合物及其密封的电子部件装置，其涉及电子部件用液态树脂组合物， A）环氧树脂，（B）在常温下为液体并且酸酐当量为200以上的环状酸酐，（C）偶联剂。