发明授权
US06713819B1 SOI MOSFET having amorphized source drain and method of fabrication
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具有非晶化源极漏极和制造方法的SOI MOSFET
- 专利标题: SOI MOSFET having amorphized source drain and method of fabrication
- 专利标题(中): 具有非晶化源极漏极和制造方法的SOI MOSFET
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申请号: US10118364申请日: 2002-04-08
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公开(公告)号: US06713819B1公开(公告)日: 2004-03-30
- 发明人: William G. En , Dong-Hyuk Ju , Srinath Krishnan
- 申请人: William G. En , Dong-Hyuk Ju , Srinath Krishnan
- 主分类号: H01L2976
- IPC分类号: H01L2976
摘要:
An integrated circuit formed in semiconductor-on-insulator format. The integrated circuit includes a layer of semiconductor material disposed on an insulating layer, where the insulating layer disposed on a substrate. A first and a second MOSFET are provided such that one of a source and a drain of the first MOSFET is disposed adjacent one of a source and a drain of the second MOSFET. An amorphous region is formed in the layer of semiconductor material and extending from an upper surface of the layer of semiconductor material to the isolation layer. The amorphous region is formed between a crystalline portion of the one of the source and the drain of the first MOSFET and a crystalline portion of the one of the source and the drain of the second MOSFET.
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