发明授权
- 专利标题： Method for planarizing circuit board and method for manufacturing semiconductor device
- 专利标题（中）： 电路板平面化方法及制造半导体器件的方法
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申请号： US10322406申请日： 2002-12-18
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公开(公告)号： US06723251B2公开(公告)日： 2004-04-20
- 发明人: Minehiro Itagaki , Yoshihiro Tomuro , Satoru Yuhaku , Kazuyoshi Amami
- 申请人： Minehiro Itagaki , Yoshihiro Tomuro , Satoru Yuhaku , Kazuyoshi Amami
- 优先权： JP9-318630 19971119
- 主分类号： B41J204
- IPC分类号： B41J204
摘要：
A method for planarizing a circuit board, has a step of fixing a circuit board having wiring layers on both sides to a board having a flat surface through an adhesive layer, wherein said circuit board is pressed from above by a flat member on fixing thereof.
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