发明授权
- 专利标题： Method of manufacturing a semiconductor device using a mold
- 专利标题（中）： 使用模具制造半导体器件的方法
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申请号： US10453606申请日： 2003-06-04
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公开(公告)号： US06723583B2公开(公告)日： 2004-04-20
- 发明人: Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
- 申请人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
- 优先权： JP2000-387825 20001220
- 主分类号： H01L2144
- IPC分类号： H01L2144
摘要：
The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.
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