公开(公告)号：US06723583B2

公开(公告)日：2004-04-20

申请号：US10453606

申请日：2003-06-04

申请人： Noriyuki Takahashi ,  Masayuki Suzuki ,  Kouji Tsuchiya ,  Takao Matsuura ,  Takanori Hashizume ,  Masahiro Ichitani ,  Kazunari Suzuki ,  Takafumi Nishita ,  Kenichi Imura ,  Takashi Miwa

发明人： Noriyuki Takahashi ,  Masayuki Suzuki ,  Kouji Tsuchiya ,  Takao Matsuura ,  Takanori Hashizume ,  Masahiro Ichitani ,  Kazunari Suzuki ,  Takafumi Nishita ,  Kenichi Imura ,  Takashi Miwa

IPC分类号： H01L2144

CPC分类号： H01L23/564 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/30105 ,  H01L2924/351 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012

摘要： The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.

摘要翻译： 将其上安装有多个半导体芯片的带状基板的背面真空吸附到模具的下半模，并且在该状态下，多个半导体芯片同时用树脂密封以形成密封构件。 此后，带状基板和密封构件从模具中释放并切割成多个半导体器件。 由此获得的半导体器件的安装可靠性得到改善。

公开(公告)号：US07015069B2

公开(公告)日：2006-03-21

申请号：US11047660

申请日：2005-02-02

申请人： Noriyuki Takahashi ,  Masayuki Suzuki ,  Kouji Tsuchiya ,  Takao Matsuura ,  Takanori Hashizume ,  Masahiro Ichitani ,  Kazunari Suzuki ,  Takafumi Nishita ,  Kenichi Imura ,  Takashi Miwa

发明人： Noriyuki Takahashi ,  Masayuki Suzuki ,  Kouji Tsuchiya ,  Takao Matsuura ,  Takanori Hashizume ,  Masahiro Ichitani ,  Kazunari Suzuki ,  Takafumi Nishita ,  Kenichi Imura ,  Takashi Miwa

IPC分类号： H01L21/44

CPC分类号： H01L23/564 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/30105 ,  H01L2924/351 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012

摘要： The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.

公开(公告)号：US20050127535A1

公开(公告)日：2005-06-16

申请号：US11047660

申请日：2005-02-02

申请人： Noriyuki Takahashi ,  Masayuki Suzuki ,  Kouji Tsuchiya ,  Takao Matsuura ,  Takanori Hashizume ,  Masahiro Ichitani ,  Kazunari Suzuki ,  Takafumi Nishita ,  Kenichi Imura ,  Takashi Miwa

发明人： Noriyuki Takahashi ,  Masayuki Suzuki ,  Kouji Tsuchiya ,  Takao Matsuura ,  Takanori Hashizume ,  Masahiro Ichitani ,  Kazunari Suzuki ,  Takafumi Nishita ,  Kenichi Imura ,  Takashi Miwa

IPC分类号： B29C45/14 ,  H01L21/56 ,  H01L23/00 ,  H01L23/12 ,  H01L23/31 ,  H01L23/498 ,  H01L23/28

CPC分类号： H01L23/564 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/30105 ,  H01L2924/351 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012

摘要： The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.

摘要翻译： 将其上安装有多个半导体芯片的带状基板的背面真空吸附到模具的下半模，并且在该状态下，多个半导体芯片同时用树脂密封以形成密封构件。 此后，带状基板和密封构件从模具中释放并切割成多个半导体器件。 由此获得的半导体器件的安装可靠性得到改善。

公开(公告)号：US06872597B2

公开(公告)日：2005-03-29

申请号：US10784276

申请日：2004-02-24

申请人： Noriyuki Takahashi ,  Masayuki Suzuki ,  Kouji Tsuchiya ,  Takao Matsuura ,  Takanori Hashizume ,  Masahiro Ichitani ,  Kazunari Suzuki ,  Takafumi Nishita ,  Kenichi Imura ,  Takashi Miwa

发明人： Noriyuki Takahashi ,  Masayuki Suzuki ,  Kouji Tsuchiya ,  Takao Matsuura ,  Takanori Hashizume ,  Masahiro Ichitani ,  Kazunari Suzuki ,  Takafumi Nishita ,  Kenichi Imura ,  Takashi Miwa

IPC分类号： B29C45/14 ,  H01L21/56 ,  H01L23/00 ,  H01L23/12 ,  H01L23/31 ,  H01L23/498 ,  H01L21/44

CPC分类号： H01L23/564 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/30105 ,  H01L2924/351 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012

摘要： The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.

公开(公告)号：US06596561B2

公开(公告)日：2003-07-22

申请号：US09987532

申请日：2001-11-15

申请人： Noriyuki Takahashi ,  Masayuki Suzuki ,  Kouji Tsuchiya ,  Takao Matsuura ,  Takanori Hashizume ,  Masahiro Ichitani ,  Kazunari Suzuki ,  Takafumi Nishita ,  Kenichi Imura ,  Takashi Miwa

发明人： Noriyuki Takahashi ,  Masayuki Suzuki ,  Kouji Tsuchiya ,  Takao Matsuura ,  Takanori Hashizume ,  Masahiro Ichitani ,  Kazunari Suzuki ,  Takafumi Nishita ,  Kenichi Imura ,  Takashi Miwa

IPC分类号： H01L2144

CPC分类号： H01L23/564 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/30105 ,  H01L2924/351 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012

摘要： The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.

摘要翻译： 将其上安装有多个半导体芯片的带状基板的背面真空吸附到模具的下半模，并且在该状态下，多个半导体芯片同时用树脂密封以形成密封构件。 此后，带状基板和密封构件从模具中释放并切割成多个半导体器件。 由此获得的半导体器件的安装可靠性得到改善。

公开(公告)号：US06399423B2

公开(公告)日：2002-06-04

申请号：US09733929

申请日：2000-12-12

申请人： Takao Matsuura ,  Yoshihiko Yamaguchi ,  Shouichi Kobayashi ,  Kouji Tsuchiya

发明人： Takao Matsuura ,  Yoshihiko Yamaguchi ,  Shouichi Kobayashi ,  Kouji Tsuchiya

IPC分类号： H01L2144

CPC分类号： H01L23/3107 ,  H01L21/4835 ,  H01L21/4842 ,  H01L21/565 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The semiconductor device comprises: a tub for supporting a semiconductor chip; a sealing body formed by sealing the semiconductor chip with a resin; a plurality of leads made of a copper alloy, exposed to the back face of the sealing body, and having a soldered layer on the exposed mounted face; and wires for connecting the pads of the semiconductor chip and the corresponding leads. In the manufacture method, the sealing body is polished, after resin-molded, at its back face with a brush to form the two widthwise edge portions, as exposed from the back face of the sealing body, of the lead into rounded faces, and the mounted face of the lead including the rounded faces is protruded at its central portion from the back face of the sealing body thereby to improve the connection reliability at the packaging time.

摘要翻译： 半导体器件包括：用于支撑半导体芯片的桶; 通过用树脂密封半导体芯片形成的密封体; 多个由铜合金制成的引线，暴露于密封体的背面，并且在暴露的安装面上具有焊接层; 以及用于连接半导体芯片的焊盘和相应引线的导线。 在制造方法中，密封体在树脂成形后用刷子在其背面进行抛光，以形成从密封体的背面露出的两个宽度方向的边缘部分，使其成为圆形面，以及 包括圆形面的引线的安装面在其中心部分处从密封体的背面突出，从而提高了封装时的连接可靠性。

公开(公告)号：US06667193B2

公开(公告)日：2003-12-23

申请号：US10108439

申请日：2002-03-29

申请人： Takao Matsuura ,  Yoshihiko Yamaguchi ,  Shouichi Kobayashi ,  Kouji Tsuchiya

发明人： Takao Matsuura ,  Yoshihiko Yamaguchi ,  Shouichi Kobayashi ,  Kouji Tsuchiya

IPC分类号： H01L2144

CPC分类号： H01L23/3107 ,  H01L21/4835 ,  H01L21/4842 ,  H01L21/565 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： To improve the connection reliability at the time of packaging a semiconductor device and to make the method management easy in a semiconductor device manufacturing method. The semiconductor device comprises: a tub 1e for supporting a semiconductor chip 2; a sealing body 3 formed by sealing the semiconductor chip 2 with a resin; a plurality of leads 1a made of a copper alloy, exposed to the back face 3a of the sealing body 3, and having a soldered layer 8 on the exposed mounted face 1d; and wires 4 for connecting the pads 2a of the semiconductor chip 2 and the corresponding leads 1a. In the manufacture method, the sealing body 3 is polished, after resin-molded, at its back face 3a with a brush to form the two widthwise edge portions, as exposed from the back face 3a of the sealing body 3, of the lead la into rounded faces, and the mounted face 1d of the lead la including the rounded faces is protruded at its central portion from the back face 3a of the sealing body 3 thereby to improve the connection reliability at the packaging time.

摘要翻译： 为了提高封装半导体器件时的连接可靠性，并且在半导体器件制造方法中使得方法管理变得容易。半导体器件包括：用于支撑半导体芯片2的桶1e; 通过用树脂密封半导体芯片2形成的密封体3; 多个由铜合金制成的引线1a，暴露于密封体3的背面3a，并且在暴露的安装面1d上具有焊接层8; 以及用于连接半导体芯片2的焊盘2a和相应引线1a的导线4。 在制造方法中，密封体3在树脂模制后用刷子在其背面3a处被抛光，以形成从密封体3的背面3a露出的两个横向边缘部分的引线1a 并且包括圆形面的引线1a的安装面1d在其中心部分处从密封体3的背面3a突出，从而提高包装时的连接可靠性。

公开(公告)号：US06897097B2

公开(公告)日：2005-05-24

申请号：US10669564

申请日：2003-09-25

申请人： Takao Matsuura ,  Yoshihiko Yamaguchi ,  Shouichi Kobayashi ,  Kouji Tsuchiya

发明人： Takao Matsuura ,  Yoshihiko Yamaguchi ,  Shouichi Kobayashi ,  Kouji Tsuchiya

IPC分类号： H01L23/12 ,  H01L21/301 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/48 ,  H01L23/50 ,  H01I21/44 ,  H01L21/50 ,  H01I21/48

CPC分类号： H01L23/3107 ,  H01L21/4835 ,  H01L21/4842 ,  H01L21/565 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The semiconductor device comprises: a tub for supporting a semiconductor chip; a sealing body formed by sealing the semiconductor chip with a resin; a plurality of leads made of a copper alloy, exposed to the back face of the sealing body, and having a soldered layer on the exposed mounted face; and wires for connecting the pads of the semiconductor chip and the corresponding leads. In the manufacture method, the sealing body is polished, after resin-molded, at its back face with a brush to form the two widthwise edge portions, as exposed from the back face of the sealing body, of the lead into rounded faces, and the mounted face of the lead including the rounded faces is protruded at its central portion from the back face of the sealing body thereby to improve the connection reliability at the packaging time.

摘要翻译： 半导体器件包括：用于支撑半导体芯片的桶; 通过用树脂密封半导体芯片形成的密封体; 多个由铜合金制成的引线，暴露于密封体的背面，并且在暴露的安装面上具有焊接层; 以及用于连接半导体芯片的焊盘和相应引线的导线。 在制造方法中，密封体在树脂成形后用刷子在其背面进行抛光，以形成从密封体的背面露出的两个宽度方向的边缘部分，使其成为圆形面，以及 包括圆形面的引线的安装面在其中心部分处从密封体的背面突出，从而提高了封装时的连接可靠性。

公开(公告)号：US06590276B2

公开(公告)日：2003-07-08

申请号：US10108483

申请日：2002-03-29

申请人： Takao Matsuura ,  Yoshihiko Yamaguchi ,  Shouichi Kobayashi ,  Kouji Tsuchiya

发明人： Takao Matsuura ,  Yoshihiko Yamaguchi ,  Shouichi Kobayashi ,  Kouji Tsuchiya

IPC分类号： H01L23495

CPC分类号： H01L23/3107 ,  H01L21/4835 ,  H01L21/4842 ,  H01L21/565 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The semiconductor device comprises: a tub for supporting a semiconductor chip; a sealing body formed by sealing the semiconductor chip with a resin; a plurality of leads made of a copper alloy, exposed to the back face of the sealing body, and having a soldered layer on the exposed mounted face; and wires for connecting the pads of the semiconductor chip and the corresponding leads. In the manufacture method, the sealing body is polished, after resin-molded, at its back face with a brush to form the two widthwise edge portions, as exposed from the back face of the sealing body, of the lead into rounded faces, and the mounted face of the lead including the rounded faces is protruded at its central portion from the back face of the sealing body thereby to improve the connection reliability at the packaging time.

摘要翻译： 半导体器件包括：用于支撑半导体芯片的桶; 通过用树脂密封半导体芯片形成的密封体; 多个由铜合金制成的引线，暴露于密封体的背面，并且在暴露的安装面上具有焊接层; 以及用于连接半导体芯片的焊盘和相应引线的导线。 在制造方法中，密封体在树脂成形后用刷子在其背面进行抛光，以形成从密封体的背面露出的两个宽度方向的边缘部分，使其成为圆形面，以及 包括圆形面的引线的安装面在其中心部分处从密封体的背面突出，从而提高了封装时的连接可靠性。

公开(公告)号：US08105878B2

公开(公告)日：2012-01-31

申请号：US11833606

申请日：2007-08-03

申请人： Haruhiko Harada ,  Takao Matsuura

发明人： Haruhiko Harada ,  Takao Matsuura

IPC分类号： H01L25/50 ,  H01L21/56 ,  H01L21/58 ,  H01L33/48

CPC分类号： H01L21/78 ,  H01L21/561 ,  H01L21/565 ,  H01L21/67115 ,  H01L21/67132 ,  H01L21/6836 ,  H01L23/3128 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2223/54486 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/92247 ,  H01L2924/00012 ,  H01L2924/00

摘要： A thermosetting tape is adopted as a dicing tape and, after package dicing, the thermosetting tape is heated, then a desired one of divided CSPs is picked up by an inverting collet. Since the thermosetting tape is heated o a predetermined temperature so that its adhesive force becomes zero, the CSP can be picked up by the inverting collet without peeling it off from the thermosetting tape. Thus, peel-off charging does not occur and therefore it is not necessary to perform a destaticizing process. As a result, it is possible to improve the production efficiency in assembling the semiconductor device (CSP).

摘要翻译： 采用热固性胶带作为切割胶带，并且在包装切割之后，热固性胶带被加热，然后由反转夹头拾取所需的分开的CSP。 由于将热固性胶带加热到预定温度以使其粘合力变为零，所以CSP可以由反转夹头拾取，而不会从热固性胶带剥离。 因此，不会发生剥离充电，因此不需要进行去静电处理。 结果，可以提高组装半导体器件（CSP）的生产效率。