Invention Grant
- Patent Title: Chip resistor with upper electrode having nonuniform thickness and method of making the resistor
- Patent Title (中): 片状电阻器，上电极厚度不均匀，制作电阻器的方法
-
Application No.: US10092257Application Date: 2002-03-07
-
Publication No.: US06724295B2Publication Date: 2004-04-20
- Inventor: Torayuki Tsukada
- Applicant: Torayuki Tsukada
- Priority: JP2001-066291 20010309
- Main IPC: H01C1012
- IPC: H01C1012
Abstract:
A method of making a chip resistor is provided. According to this method, an aggregate board is first prepared which includes a first region and a second region which are spaced from each other via an excess portion. Then, a conductor pattern is formed which extends to bridge the first region and the second region. Subsequently, a resistor element is formed in each of the first region and the second region for connection to the conductor pattern. Then, the aggregate board is cut at the excess portion. The conductor pattern includes a thinner-walled portion extending across the excess portion and a thicker-walled portion connected to the thinner-walled portion and spaced from the excess portion.
Public/Granted literature
- US20020130761A1 Chip resistor with upper electrode having nonuniform thickness and method of making the resistor Public/Granted day:2002-09-19
Information query
