公开(公告)号：US20140247108A1

公开(公告)日：2014-09-04

申请号：US14350672

申请日：2012-10-12

Applicant: Torayuki Tsukada ,  Kentaro Naka

Inventor： Torayuki Tsukada ,  Kentaro Naka

IPC: H01C7/00 ,  H01C17/00

CPC classification number: H01C7/00 ,  H01C7/003 ,  H01C17/00 ,  H01C17/006 ,  H01C17/02 ,  H01C17/065 ,  H01C17/242 ,  Y10T29/49082

Abstract: [Object]A chip resistor suitable for enhancing manufacturing efficiency is provided.[Means]A chip resistor includes a first electrode 1, a second electrode 2, a resistor portion 3, a first intermediate layer 4 connected to the first electrode 1 and the resistor portion 3, a second intermediate layer 5 connected to the second electrode 2 and the resistor portion 3, a coating film 61 covering the first electrode 1, and oxides existing in the first intermediate layer 4. The coating film 61 is made of a material having a higher absorptance of a laser beam of a predetermined wavelength than that of the material forming the first electrode 1. The oxides are oxides of the material forming the coating film 61.

Abstract translation: 提供了一种适合于提高制造效率的片式电阻器。 芯片电阻器包括第一电极1，第二电极2，电阻器部分3，连接到第一电极1和电阻器部分3的第一中间层4，连接到第二电极2的第二中间层5 电阻部分3，覆盖第一电极1的涂膜61和存在于第一中间层4中的氧化物。涂膜61由具有比预定波长的预定波长的激光束的吸收率更高的材料制成 形成第一电极1的材料。氧化物是形成涂膜61的材料的氧化物。

公开(公告)号：US08044765B2

公开(公告)日：2011-10-25

申请号：US12328529

申请日：2008-12-04

Applicant: Torayuki Tsukada

Inventor： Torayuki Tsukada

IPC: H01C1/142

CPC classification number: H01C1/142 ,  H01C17/28 ,  H05K3/3442 ,  Y10T29/49082 ,  Y10T29/49101

Abstract: A chip resistor includes a metal resistor element made in the form of a chip that includes an upper surface, a lower surface, two end surfaces, and two side surfaces. Two electrodes are formed on the resistor element to be spaced from each other in a longitudinal direction of the resistor element. Each of the electrodes is formed directly on the resistor element and extends continuously from the lower surface onto the upper surface via a corresponding one of the two end surfaces.

Abstract translation: 芯片电阻器包括以芯片形式制成的金属电阻元件，其包括上表面，下表面，两个端表面和两个侧表面。 两个电极形成在电阻元件上，以在电阻元件的纵向彼此间隔开。 每个电极直接形成在电阻元件上，并通过两个端面中的相应一个从下表面连续延伸到上表面。

公开(公告)号：US07907046B2

公开(公告)日：2011-03-15

申请号：US11991513

申请日：2006-09-04

Applicant: Torayuki Tsukada

Inventor： Torayuki Tsukada

IPC: H01C1/012

CPC classification number: H01C1/012 ,  H01C1/142 ,  H01C7/003 ,  H01C17/006 ,  Y10T29/49099 ,  Y10T29/49101

Abstract: The chip resistor (1) of the present invention includes an insulating substrate (2) in the form of a chip, a pair of terminal electrodes (3, 4) formed on both ends of the insulating substrate (2), a plurality of resistor films (5) formed on an obverse surface of the insulating substrate (2) in parallel with each other between the paired terminal electrodes (3, 4), and a cover coat formed on the obverse surface of the insulating substrate (2) to cover the resistor films (5). In the chip resistor (1), one of the terminal electrodes (3) includes individual upper electrodes (8) each formed on the obverse surface of the insulating substrate (3, 4) to be independently connected to a respective one of the resistor films (5) and a side electrode (9) formed on a side surface of the insulating substrate (2) to be connected to all the individual upper electrodes (8).

Abstract translation: 本发明的芯片电阻器（1）包括芯片形式的绝缘基板（2），形成在绝缘基板（2）两端的一对端子电极（3,4），多个电阻器 在绝缘基板（2）的正面上在成对的端子电极（3,4）之间彼此平行地形成的膜（5）和形成在绝缘基板（2）的正面上的覆盖膜 电阻膜（5）。 在片状电阻器（1）中，端子电极（3）中的一个包括各自形成在绝缘基板（3,4）的正面上的独立的上电极（8），以独立地连接到电阻膜 （5）和形成在绝缘基板（2）的侧表面上以与所有单独的上电极（8）连接的侧电极（9）。

公开(公告)号：US07786842B2

公开(公告)日：2010-08-31

申请号：US11883856

申请日：2006-02-28

Applicant: Torayuki Tsukada ,  Masaki Yoneda

Inventor： Torayuki Tsukada ,  Masaki Yoneda

IPC: H01C1/012

CPC classification number: H01C1/148 ,  H01C1/032 ,  H01C1/14 ,  H01C7/003 ,  H01C17/006 ,  Y10T29/49099

Abstract: The chip resistor (1) includes an insulating substrate (2) and a main upper electrode (4) formed on a main surface of the insulating substrate (2). On the main surface of the insulating substrate (2), a resistor film (5) including an end (5a) overlapping the upper surface of main upper electrode (4) is formed. The resistor film (5) is covered by a protective coat (7, 8). An auxiliary upper electrode (6) is formed on the upper surface of the main upper electrode (4). The auxiliary upper electrode (6) includes an inner end (6a) overlapping the upper surface of the end (5a) of the resistor film (5). The protective coat (7, 8) overlaps the inner end (6a) of the auxiliary upper electrode (6).

Abstract translation: 芯片电阻器（1）包括绝缘基板（2）和形成在绝缘基板（2）的主表面上的主上电极（4）。 在绝缘基板（2）的主表面上，形成包括与主上电极（4）的上表面重叠的端部（5a）的电阻膜（5）。 电阻膜（5）被保护层（7,8）覆盖。 辅助上电极（6）形成在主上电极（4）的上表面上。 辅助上电极（6）包括与电阻膜（5）的端部（5a）的上表面重叠的内端（6a）。 保护涂层（7,8）与辅助上电极（6）的内端（6a）重叠。

公开(公告)号：US07782172B2

公开(公告)日：2010-08-24

申请号：US11991681

申请日：2006-09-04

Applicant: Torayuki Tsukada

Inventor： Torayuki Tsukada

IPC: H01C10/00

CPC classification number: H01C10/005 ,  H01C10/14

Abstract: A variable chip resistor (1) of the present invention includes a resistor element (2) made of a metal plate which is in the form of a chip and has a predetermined specific resistance. Terminal electrodes (3, 4) for soldering are provided at both ends of the resistor element (2), and at least one adjustment hole (9) is formed in the resistor element (2) at a portion between the terminal electrodes (3, 4). An adjustment rod (10) is inserted into the adjustment hole (9) in close contact with the inner surface of the adjustment hole. The adjustment rod (10) is made of an electroconductive material, and its insertion depth is adjustable in the axial direction of the adjustment hole (9).

Abstract translation: 本发明的可变片式电阻器（1）包括由金属板制成的电阻元件（2），该金属板是芯片形式并具有预定的电阻率。 在电阻元件（2）的两端设置用于焊接的端子电极（3,4），并且在电极元件（2）的端子电极（3）之间的部分形成有至少一个调整孔（9） 4）。 调整杆（10）与调节孔的内表面紧密接触地插入到调节孔（9）中。 调节杆（10）由导电材料制成，其插入深度可在调节孔（9）的轴向调节。

公开(公告)号：US07378937B2

公开(公告)日：2008-05-27

申请号：US11703979

申请日：2007-02-08

Applicant: Torayuki Tsukada

Inventor： Torayuki Tsukada

IPC: H01C1/012

CPC classification number: H01C1/144 ,  H01C7/003 ,  H01C17/006 ,  H05K3/3442

Abstract: A chip resistor includes a resistor element in the form of a chip, and at least two electrodes formed on the resistor element. The resistor element includes an upper surface, a lower surface, and two end surfaces extending between the upper and the lower surfaces and spaced from each other. The two electrodes are provided on the lower surface of the resistor element. Each of the end surfaces of the resistor element is formed with a conductor film integrally connected to a corresponding one of the electrodes. The conductor film is made of copper, for example, and is higher in solder-wettability than the resistor element.

Abstract translation: 芯片电阻器包括芯片形式的电阻元件和形成在电阻元件上的至少两个电极。 电阻器元件包括上表面，下表面和在上表面和下表面之间延伸并且彼此间隔开的两个端表面。 两个电极设置在电阻元件的下表面上。 电阻元件的每个端面形成有与相应的一个电极整体连接的导体膜。 导体膜例如由铜制成，并且焊料润湿性高于电阻元件。

公开(公告)号：US20070018782A1

公开(公告)日：2007-01-25

申请号：US11526975

申请日：2006-09-26

Applicant: Torayuki Tsukada

Inventor： Torayuki Tsukada

IPC: H01C1/012

CPC classification number: H01C17/281 ,  H01C1/148 ,  H01C17/006 ,  Y10T29/49082

Abstract: A chip resistor includes a metal resistor element having a flat lower surface. The lower surface is formed with two electrodes spaced from each other, and an insulating resin film is formed between these electrodes. Each of the electrodes partially overlaps the insulating film so that a portion of the insulating film is inserted between each of the electrodes and the lower surface of the resistor element.

Abstract translation: 芯片电阻器包括具有平坦的下表面的金属电阻器元件。 下表面形成有彼此间隔开的两个电极，并且在这些电极之间形成绝缘树脂膜。 每个电极部分地与绝缘膜重叠，使得绝缘膜的一部分插入每个电极和电阻元件的下表面之间。

公开(公告)号：US08081059B2

公开(公告)日：2011-12-20

申请号：US12692827

申请日：2010-01-25

Applicant: Masanori Tanimura ,  Torayuki Tsukada ,  Kousaku Tanaka

Inventor： Masanori Tanimura ,  Torayuki Tsukada ,  Kousaku Tanaka

IPC: H01C1/012

CPC classification number: H01C17/281 ,  H01C1/148 ,  H01C7/003 ,  H01C17/006 ,  Y10T29/49099

Abstract: A chip resistor (A1) includes a chip-like resistor element (1), two electrodes (31) spaced from each other on the bottom surface (1a) of the resistor element, and an insulation film (21) between the two electrodes. Each electrode (31) has an overlapping portion (31c) which overlaps the insulation film (21) as viewed in the vertical direction.

Abstract translation: 片状电阻器（A1）包括片状电阻元件（1），在电阻元件的底面上彼此间隔开的两个电极（31）和两个电极之间的绝缘膜（21）。 每个电极（31）具有在垂直方向上观察时与绝缘膜（21）重叠的重叠部分（31c）。

公开(公告)号：US07612429B2

公开(公告)日：2009-11-03

申请号：US10533489

申请日：2003-10-30

Applicant: Torayuki Tsukada ,  Tadatoshi Miwa

Inventor： Torayuki Tsukada ,  Tadatoshi Miwa

IPC: H01L29/93

CPC classification number: H01C1/144 ,  H05K3/3442

Abstract: A chip resistor (A1) comprises a first insulation layer (2A) covering the regions between a plurality of electrodes (3) on a rear surface (10a) of a resistor (1), and a second insulation layer covering a pair of side faces of the resistor (1). Inadvertent adhesion of solder to an improper part of the resistor (1) can thereby be eliminated. A solder layer (4) is preferably formed on a pair of end faces (10d) of the resistor (1). In so doing, a solder fillet can be formed appropriately.

Abstract translation: 片状电阻器（A1）包括覆盖电阻器（1）的背面（10a）上的多个电极（3）之间的区域的第一绝缘层（2A）和覆盖一对侧面 的电阻（1）。 因此可以消除焊料对电阻器（1）的不正确部分的无意附着。 焊料层（4）优选形成在电阻器（1）的一对端面（10d）上。 这样做可以适当地形成焊锡圆角。

公开(公告)号：US20090160602A1

公开(公告)日：2009-06-25

申请号：US11990405

申请日：2006-08-02

Applicant: Torayuki Tsukada

Inventor： Torayuki Tsukada

IPC: H01C1/012

CPC classification number: H01C7/003 ,  H01C1/084 ,  H01C1/148 ,  H05K3/3442

Abstract: The chip resistor (1) of the present invention includes a pair of terminal electrodes (4, 5) provided at ends of an insulating substrate (2) in the form of a chip, and a resistor film (3) formed on the upper surface of the insulating substrate (2) for electrical connection to the paired terminal electrodes (4, 5) and formed with a trimming groove (3a) for setting the resistance. The paired terminal electrodes (4, 5) include a lower electrode (4b) formed on the lower surface of the insulating substrate (2). The lower electrode (4b) extends up to a position directly below a narrower portion (8) of the resistor film (3) which has a relatively small width due to the formation of the trimming groove (3a) in the resistor film (3).

Abstract translation: 本发明的芯片电阻器（1）包括设置在芯片形式的绝缘基板（2）的端部的一对端子电极（4,5）和形成在上表面上的电阻膜（3） 和与成对的端子电极（4,5）电连接并形成有用于设定电阻的修整槽（3a）的绝缘基板（2）。 成对的端子电极（4,5）包括形成在绝缘基板（2）的下表面上的下电极（4b）。 下电极（4b）由于在电阻膜（3）中形成修整槽（3a）而延伸到电阻膜（3）的较窄部分（8）的正下方的位置，该电阻膜具有相对较小的宽度， 。