发明授权
- 专利标题： Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
- 专利标题（中）： 用于在工件的电抛光和/或电镀期间保持和定位半导体工件的方法和装置
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申请号： US09856855申请日： 2001-05-23
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公开(公告)号： US06726823B1公开(公告)日： 2004-04-27
- 发明人: Hui Wang , Felix Gutman , Voha Nuch
- 申请人： Hui Wang , Felix Gutman , Voha Nuch
- 主分类号： C25D500
- IPC分类号： C25D500
摘要：
A wafer chuck assembly for holding a wafer during electroplating and/or electropolishing of the wafer includes a wafer chuck for receiving the wafer. The wafer chuck assembly also includes an actuator assembly for moving the wafer chuck between a first and a second position. When in the first position, the wafer chuck is opened. When in the second position, the wafer chuck is closed.
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