The present invention is an edge grip aligner with buffering capabilities and a method for increasing the throughput of wafers through the device. According to one embodiment, the present invention has first and second buffer arms, and a chuck arm. A workpiece can be aligned while supported on the chuck arm. Once the workpiece is aligned, the chuck arm transfers the workpiece to the buffer arms so that a second workpiece can be aligned on the chuck arm. While the second workpiece is being aligned, an end effector can transfer the first workpiece away from the buffer arms and retrieve another workpiece to place upon the chuck arm.