Invention Grant
- Patent Title: Method and apparatus for testing a substrate
- Patent Title (中): 用于测试衬底的方法和装置
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Application No.: US09977549Application Date: 2001-10-15
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Publication No.: US06730906B2Publication Date: 2004-05-04
- Inventor: Matthias Brunner , Ralf Schmid
- Applicant: Matthias Brunner , Ralf Schmid
- Priority: DE19802848 19980126
- Main IPC: H01J3728
- IPC: H01J3728

Abstract:
A method and apparatus for testing a substrate, wherein a particle beam is directed onto the substrate and emitted secondary particles are detected with a detector and then evaluated. The location of the site at which the secondary particles are emitted on the substrate relative to the position of the detector is taken into consideration during testing.
Public/Granted literature
- US20020024023A1 Method and apparatus for testing a substrate Public/Granted day:2002-02-28
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