发明授权
- 专利标题： Method for mounting electronic circuit chip
- 专利标题（中）： 电子电路芯片的安装方法
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申请号： US09856758申请日： 2001-09-14
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公开(公告)号： US06731509B1公开(公告)日： 2004-05-04
- 发明人: Chikashi Okamoto , Kazuo Takaragi , Kazutaka Tsuji , Mitsuo Usami , Chizuko Yasunobu , Asahiko Sobe , Yasuhiro Tsunemi , Hiroyuki Yagi
- 申请人： Chikashi Okamoto , Kazuo Takaragi , Kazutaka Tsuji , Mitsuo Usami , Chizuko Yasunobu , Asahiko Sobe , Yasuhiro Tsunemi , Hiroyuki Yagi
- 优先权： JP10-339265 19981130
- 主分类号： H05K706
- IPC分类号： H05K706
摘要：
In a method of mounting a planar electronic circuit chip onto a flexible sheet together with another planar electronic element, the electronic circuit part and the another electric element are selected so that the planar surface of the another electric element is greater than the planar surface of the electronic circuit chip, and the another electric element and the electronic circuit chip are mounted on the sheet so that the planar surface of the another electric element and the planar surface of the electronic circuit chip are in parallel with the sheet surface, and the planer surface of the electronic circuit chip is accommodated within the planar surface of the another electric element as viewed in a direction perpendicular to the sheet surface.
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