公开(公告)号：US07549208B2

公开(公告)日：2009-06-23

申请号：US10687753

申请日：2003-10-20

申请人： Chikashi Okamoto ,  Kazuo Takaragi ,  Kazutaka Tsuji ,  Mitsuo Usami ,  Chizuko Yasunobu ,  Asahiko Sobe ,  Yasuhiro Tsunemi ,  Hiroyuki Yagi

发明人： Chikashi Okamoto ,  Kazuo Takaragi ,  Kazutaka Tsuji ,  Mitsuo Usami ,  Chizuko Yasunobu ,  Asahiko Sobe ,  Yasuhiro Tsunemi ,  Hiroyuki Yagi

IPC分类号： H01Q17/00

CPC分类号： G06K19/07747 ,  G06K19/07718 ,  G06K19/07745 ,  G06K19/07749 ,  H01L2924/0002 ,  H01L2924/3511 ,  Y10T29/49018 ,  H01L2924/00

摘要： In a method of mounting a planar electronic circuit chip onto a flexible sheet together with another planar electronic element, the electronic circuit part and the another electric element are selected so that the planar surface of the another electric element is greater than the planar surface of the electronic circuit chip, and the another electric element and the electronic circuit chip are mounted on the sheet so that the planar surface of the another electric element and the planar surface of the electronic circuit chip are in parallel with the sheet surface, and the planer surface of the electronic circuit chip is accommodated within the planar surface of the another electric element as viewed in a direction perpendicular to the sheet surface.

摘要翻译： 在将平面电子电路芯片与另一平面电子元件一起安装在柔性片材上的方法中，选择电子电路部件和另一个电气元件，使得另一个电气元件的平坦表面大于 电子电路芯片，另一个电子元件和电子电路芯片安装在片材上，使得另一个电子元件的平面和电子电路芯片的平面与片材表面平行，并且平面 的电子电路芯片在垂直于片材表面的方向上被容纳在另一电气元件的平面内。

公开(公告)号：US06731509B1

公开(公告)日：2004-05-04

申请号：US09856758

申请日：2001-09-14

申请人： Chikashi Okamoto ,  Kazuo Takaragi ,  Kazutaka Tsuji ,  Mitsuo Usami ,  Chizuko Yasunobu ,  Asahiko Sobe ,  Yasuhiro Tsunemi ,  Hiroyuki Yagi

发明人： Chikashi Okamoto ,  Kazuo Takaragi ,  Kazutaka Tsuji ,  Mitsuo Usami ,  Chizuko Yasunobu ,  Asahiko Sobe ,  Yasuhiro Tsunemi ,  Hiroyuki Yagi

IPC分类号： H05K706

CPC分类号： G06K19/07747 ,  G06K19/07718 ,  G06K19/07745 ,  G06K19/07749 ,  H01L2924/0002 ,  H01L2924/3511 ,  Y10T29/49018 ,  H01L2924/00

摘要： In a method of mounting a planar electronic circuit chip onto a flexible sheet together with another planar electronic element, the electronic circuit part and the another electric element are selected so that the planar surface of the another electric element is greater than the planar surface of the electronic circuit chip, and the another electric element and the electronic circuit chip are mounted on the sheet so that the planar surface of the another electric element and the planar surface of the electronic circuit chip are in parallel with the sheet surface, and the planer surface of the electronic circuit chip is accommodated within the planar surface of the another electric element as viewed in a direction perpendicular to the sheet surface.

摘要翻译： 在将平面电子电路芯片与另一平面电子元件一起安装在柔性片材上的方法中，选择电子电路部件和另一个电气元件，使得另一个电气元件的平坦表面大于 电子电路芯片，另一个电子元件和电子电路芯片安装在片材上，使得另一个电子元件的平面和电子电路芯片的平面与片材表面平行，并且平面 的电子电路芯片在垂直于片材表面的方向上被容纳在另一电气元件的平面内。

公开(公告)号：US07309019B2

公开(公告)日：2007-12-18

申请号：US11324283

申请日：2006-01-04

申请人： Chikashi Okamoto ,  Kazuo Takaragi ,  Kazutaka Tsuji ,  Mitsuo Usami ,  Chizuko Yasunobu ,  Asahiko Isobe ,  Yasuhiro Tsunemi ,  Hiroyuki Yagi

发明人： Chikashi Okamoto ,  Kazuo Takaragi ,  Kazutaka Tsuji ,  Mitsuo Usami ,  Chizuko Yasunobu ,  Asahiko Isobe ,  Yasuhiro Tsunemi ,  Hiroyuki Yagi

IPC分类号： G06K19/06

CPC分类号： G06Q20/042 ,  G07D7/003 ,  G07D7/0047 ,  G07D7/01 ,  G07D7/12 ,  G07D7/2033

摘要： A method of checking a sheet as to forgery thereof, the sheet being provided with an electronic circuit chip from or in which information can be read out or written and having visible information. The method includes a step of encrypting the visible information of the sheet and storing the encrypted visible information in the electronic circuit chip, and a step of determining discriminatively the authenticity of the sheet by comparing the visible information of the sheet with the information stored in the electronic circuit chip.

摘要翻译： 一种检查纸张的伪造方法，该纸张具有从其中读出或写入信息并具有可见信息的电子电路芯片。 该方法包括加密片材的可见信息并将加密的可见信息存储在电子电路芯片中的步骤，以及通过将片材的可见信息与存储在片材中的信息进行比较来区别地确定片材的真实性的步骤 电子电路芯片。

公开(公告)号：US07007854B2

公开(公告)日：2006-03-07

申请号：US10673451

申请日：2003-09-30

申请人： Chikashi Okamoto ,  Kazuo Takaragi ,  Kazutaka Tsuji ,  Mitsuo Usami ,  Chizuko Yasunobu ,  Asahiko Isobe ,  Yasuhiro Tsunemi ,  Hiroyuki Yagi

发明人： Chikashi Okamoto ,  Kazuo Takaragi ,  Kazutaka Tsuji ,  Mitsuo Usami ,  Chizuko Yasunobu ,  Asahiko Isobe ,  Yasuhiro Tsunemi ,  Hiroyuki Yagi

IPC分类号： G06K19/06

CPC分类号： G06Q20/042 ,  G07D7/003 ,  G07D7/0047 ,  G07D7/01 ,  G07D7/12 ,  G07D7/2033

摘要： A method of checking sheets as to forgery thereof, the sheet being provided with an electronic circuit chip from which information can be read cut or written and having visible information. The method includes a step of encrypting the visible information of the sheet and storing the encrypted visible information in the electronic circuit chip, and a step of determining discriminatively the authenticity of the sheet by comparing the visible information of the sheet with the information stored in the electronic circuit chip.

摘要翻译： 一种检查纸张伪造的方法，该纸张设置有电子电路芯片，从该电子电路芯片可以读取或写入信息并具有可见信息。 该方法包括加密片材的可见信息并将加密的可见信息存储在电子电路芯片中的步骤，以及通过将片材的可见信息与存储在片材中的信息进行比较来区别地确定片材的真实性的步骤 电子电路芯片。

公开(公告)号：US20060108412A1

公开(公告)日：2006-05-25

申请号：US11324283

申请日：2006-01-04

申请人： Chikashi Okamoto ,  Kazuo Takaragi ,  Kazutaka Tsuji ,  Mitsuo Usami ,  Chizuko Yasunobu ,  Asahiko Isobe ,  Yasuhiro Tsunemi ,  Hiroyuki Yagi

发明人： Chikashi Okamoto ,  Kazuo Takaragi ,  Kazutaka Tsuji ,  Mitsuo Usami ,  Chizuko Yasunobu ,  Asahiko Isobe ,  Yasuhiro Tsunemi ,  Hiroyuki Yagi

IPC分类号： G07F19/00

CPC分类号： G06Q20/042 ,  G07D7/003 ,  G07D7/0047 ,  G07D7/01 ,  G07D7/12 ,  G07D7/2033

摘要： A method of checking sheets as to forgery thereof, the sheet being provided with an electronic circuit chip from or in which information can be read out or written and having visible information. The method includes a step of encrypting the visible information of the sheet and storing the encrypted visible information in the electronic circuit chip, and a step of determining discriminatively the authenticity of the sheet by comparing the visible information of the sheet with the information stored in the electronic circuit chip.

摘要翻译： 一种检查纸张伪造的方法，该纸张具有从其中读出或写入信息并具有可见信息的电子电路芯片。 该方法包括加密片材的可见信息并将加密的可见信息存储在电子电路芯片中的步骤，以及通过将片材的可见信息与存储在片材中的信息进行比较来区别地确定片材的真实性的步骤 电子电路芯片。

公开(公告)号：US06659353B1

公开(公告)日：2003-12-09

申请号：US09857271

申请日：2001-11-27

申请人： Chikashi Okamoto ,  Kazuo Takaragi ,  Kazutaka Tsuji ,  Mitsuo Usami ,  Chizuko Yasunobu ,  Asahiko Isobe ,  Yasuhiro Tsunemi ,  Hiroyuki Yagi

发明人： Chikashi Okamoto ,  Kazuo Takaragi ,  Kazutaka Tsuji ,  Mitsuo Usami ,  Chizuko Yasunobu ,  Asahiko Isobe ,  Yasuhiro Tsunemi ,  Hiroyuki Yagi

IPC分类号： G06K1906

CPC分类号： G06Q20/042 ,  G07D7/003 ,  G07D7/0047 ,  G07D7/01 ,  G07D7/12 ,  G07D7/2033

摘要： A method of checking sheets as to forgery thereof, the sheet being provided with an electronic circuit chip from which information can be read out or written and having visible information. The method includes a step of encrypting the visible information of the sheet and storing the encrypted visible information in the electronic circuit chip, and a step of determining discriminatively the authenticity of the sheet by comparing the visible information of the sheet with the information stored in the electronic circuit chip.

摘要翻译： 一种检查纸张伪造的方法，该纸张具有电子电路芯片，从该电子电路芯片可以读出或写入信息并具有可见信息。 该方法包括加密片材的可见信息并将加密的可见信息存储在电子电路芯片中的步骤，以及通过将片材的可见信息与存储在片材中的信息进行比较来区别地确定片材的真实性的步骤 电子电路芯片。

公开(公告)号：US07298029B2

公开(公告)日：2007-11-20

申请号：US11101577

申请日：2005-04-08

申请人： Mitsuo Usami ,  Kazutaka Tsuji ,  Takeshi Saito ,  Akira Sato ,  Kenji Sameshima ,  Kazuo Takaragi ,  Chizuko Yasunobu

发明人： Mitsuo Usami ,  Kazutaka Tsuji ,  Takeshi Saito ,  Akira Sato ,  Kenji Sameshima ,  Kazuo Takaragi ,  Chizuko Yasunobu

IPC分类号： H01L23/02 ,  H01L29/40

CPC分类号： B42D25/30 ,  B42D25/29 ,  B42D2033/46 ,  D21H21/48 ,  G06K7/0008 ,  G06K19/073 ,  G06K19/07363 ,  G06K19/07372 ,  G06K19/07728 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  H01L21/6835 ,  H01L23/3171 ,  H01L23/49855 ,  H01L23/576 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/6835 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2223/6677 ,  H01L2224/05001 ,  H01L2224/16 ,  H01L2224/2518 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/29293 ,  H01L2224/29298 ,  H01L2224/73204 ,  H01L2224/7565 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01Q1/2208 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A non-contact identification semiconductor device is provided with a semiconductor chip including a receiving circuit that receives an inquiry to the non-contact identification semiconductor device, a memory that stores identification information of multiple bits and a sending circuit that sends the identification information. An antenna coupled to said semiconductor chip receives the identification information from said semiconductor chip and transmits the identification information outside of said non-contact semiconductor. The long side length of the semiconductor chip is not greater than 0.5 mm in plane dimension, and the identification information is stored by a pattern printed by an electron beam.

摘要翻译： 非接触式识别半导体器件设置有半导体芯片，该半导体芯片包括接收对非接触识别半导体器件的查询的接收电路，存储多个比特的识别信息的存储器和发送识别信息的发送电路。 耦合到所述半导体芯片的天线从所述半导体芯片接收所述识别信息，并将所述识别信息发送到所述非接触式半导体之外。 半导体芯片的长边长度在平面尺寸上不大于0.5mm，并且通过由电子束打印的图案来存储识别信息。

公开(公告)号：US07061083B1

公开(公告)日：2006-06-13

申请号：US09868231

申请日：1999-12-10

申请人： Mitsuo Usami ,  Kazutaka Tsuji ,  Takeshi Saito ,  Akira Sato ,  Kenji Sameshima ,  Kazuo Takaragi ,  Chizuko Yasunobu

发明人： Mitsuo Usami ,  Kazutaka Tsuji ,  Takeshi Saito ,  Akira Sato ,  Kenji Sameshima ,  Kazuo Takaragi ,  Chizuko Yasunobu

IPC分类号： H01L23/02 ,  H01L29/40

CPC分类号： B42D25/30 ,  B42D25/29 ,  B42D2033/46 ,  D21H21/48 ,  G06K7/0008 ,  G06K19/073 ,  G06K19/07363 ,  G06K19/07372 ,  G06K19/07728 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  H01L21/6835 ,  H01L23/3171 ,  H01L23/49855 ,  H01L23/576 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/6835 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2223/6677 ,  H01L2224/05001 ,  H01L2224/16 ,  H01L2224/2518 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/29293 ,  H01L2224/29298 ,  H01L2224/73204 ,  H01L2224/7565 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01Q1/2208 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： This Application is intended to provide a method for effectively protecting paper or film-form media against forgery. This can be achieved by, for example, embedding in a paper or film-form medium a thin semiconductor chip up to 0.5 mm square, equipped with an antenna, and characterized in that the side walls of the semiconductor chip are formed using oxide films, and in that multiple such semiconductor chips are separated by etching. Limiting the size of these semiconductor chips to 0.5 mm or less enables improvement against bending and concentrated loads, and separating the semiconductor chips by etching results in semiconductor chips free from cracking and breakage. Also, the oxide films constituting the side walls of the semiconductor chips prevents short-circuiting at edges during connection to the respective antennas. Thus, simplified processes can be adopted.

摘要翻译： 本申请旨在提供一种有效保护纸张或胶片形式介质免于伪造的方法。 这可以通过例如在纸或薄膜介质中嵌入具有天线的0.5mm见方的半导体芯片来实现，其特征在于，半导体芯片的侧壁使用氧化膜形成， 并且通过蚀刻分离多个这样的半导体芯片。 将这些半导体芯片的尺寸限制在0.5mm以下可以改善弯曲和集中负载，并且通过蚀刻分离半导体芯片，导致半导体芯片没有破裂和断裂。 此外，构成半导体芯片的侧壁的氧化物膜防止在连接到各个天线期间的边缘短路。 因此，可以采用简化的过程。

公开(公告)号：US20050194591A1

公开(公告)日：2005-09-08

申请号：US11101577

申请日：2005-04-08

申请人： Mitsuo Usami ,  Kazutaka Tsuji ,  Takeshi Saito ,  Akira Sato ,  Kenji Sameshima ,  Kazuo Takaragi ,  Chizuko Yasunobu

发明人： Mitsuo Usami ,  Kazutaka Tsuji ,  Takeshi Saito ,  Akira Sato ,  Kenji Sameshima ,  Kazuo Takaragi ,  Chizuko Yasunobu

IPC分类号： B42D15/00 ,  D21H21/48 ,  G06K7/00 ,  G06K19/073 ,  G06K19/077 ,  H01L21/60 ,  H01L21/68 ,  H01L23/31 ,  H01L23/498 ,  H01L23/58 ,  H01Q1/22

CPC分类号： B42D25/30 ,  B42D25/29 ,  B42D2033/46 ,  D21H21/48 ,  G06K7/0008 ,  G06K19/073 ,  G06K19/07363 ,  G06K19/07372 ,  G06K19/07728 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  H01L21/6835 ,  H01L23/3171 ,  H01L23/49855 ,  H01L23/576 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/6835 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2223/6677 ,  H01L2224/05001 ,  H01L2224/16 ,  H01L2224/2518 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/29293 ,  H01L2224/29298 ,  H01L2224/73204 ,  H01L2224/7565 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01Q1/2208 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A non-contact identification semiconductor device is provided with a semiconductor chip including a receiving circuit that receives an inquiry to the non-contact identification semiconductor device, a memory that stores identification information of multiple bits and a sending circuit that sends the identification information. An antenna coupled to said semiconductor chip receives the identification information from said semiconductor chip and transmits the identification information outside of said non-contact semiconductor. The long side length of the semiconductor chip is not greater than 0.5 mm in plane dimension, and the identification information is stored by a pattern printed by an electron beam.

摘要翻译： 非接触式识别半导体器件设置有半导体芯片，该半导体芯片包括接收对非接触识别半导体器件的查询的接收电路，存储多个比特的识别信息的存储器和发送识别信息的发送电路。 耦合到所述半导体芯片的天线从所述半导体芯片接收所述识别信息，并将所述识别信息发送到所述非接触式半导体之外。 半导体芯片的长边长度在平面尺寸上不大于0.5mm，并且通过由电子束打印的图案来存储识别信息。

公开(公告)号：US20080054427A1

公开(公告)日：2008-03-06

申请号：US11877046

申请日：2007-10-23

申请人： Mitsuo USAMI ,  Kazutaka Tsuji ,  Takeshi Saito ,  Akira Sato ,  Kenji Sameshima ,  Kazuo Takaragi ,  Chizuko Yasunobu

发明人： Mitsuo USAMI ,  Kazutaka Tsuji ,  Takeshi Saito ,  Akira Sato ,  Kenji Sameshima ,  Kazuo Takaragi ,  Chizuko Yasunobu

IPC分类号： H01L23/02

CPC分类号： B42D25/30 ,  B42D25/29 ,  B42D2033/46 ,  D21H21/48 ,  G06K7/0008 ,  G06K19/073 ,  G06K19/07363 ,  G06K19/07372 ,  G06K19/07728 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  H01L21/6835 ,  H01L23/3171 ,  H01L23/49855 ,  H01L23/576 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/6835 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2223/6677 ,  H01L2224/05001 ,  H01L2224/16 ,  H01L2224/2518 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/29293 ,  H01L2224/29298 ,  H01L2224/73204 ,  H01L2224/7565 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01Q1/2208 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A non-contact identification semiconductor device is provided with a semiconductor chip including a receiving circuit that receives an inquiry to the non-contact identification semiconductor device, a memory that stores identification information of multiple bits and a sending circuit that sends the identification information. An antenna coupled to said semiconductor chip receives the identification information from said semiconductor chip and transmits the identification information outside of said non-contact semiconductor. The long side length of the semiconductor chip is not greater than 0.5 mm in plane dimension, and the identification information is stored by a pattern printed by an electron beam.

摘要翻译： 非接触式识别半导体器件设置有半导体芯片，该半导体芯片包括接收对非接触识别半导体器件的查询的接收电路，存储多个比特的识别信息的存储器和发送识别信息的发送电路。 耦合到所述半导体芯片的天线从所述半导体芯片接收所述识别信息，并将所述识别信息发送到所述非接触式半导体之外。 半导体芯片的长边长度在平面尺寸上不大于0.5mm，并且通过由电子束打印的图案来存储识别信息。