发明授权
US06734549B2 Semiconductor device having a device for testing the semiconductor
失效
具有用于测试半导体的器件的半导体器件
- 专利标题: Semiconductor device having a device for testing the semiconductor
- 专利标题(中): 具有用于测试半导体的器件的半导体器件
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申请号: US10187269申请日: 2002-07-02
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公开(公告)号: US06734549B2公开(公告)日: 2004-05-11
- 发明人: Sadami Takeoka , Mitsuyasu Ohta , Osamu Ichikawa , Masayoshi Yoshimura
- 申请人: Sadami Takeoka , Mitsuyasu Ohta , Osamu Ichikawa , Masayoshi Yoshimura
- 优先权: JP2001-201950 20010703
- 主分类号: H01L2312
- IPC分类号: H01L2312
摘要:
A semiconductor device constructed by mounting a plurality of chip intellectual properties (IPs) on a common semiconductor wiring substrate, a method for testing the device and a method for mounting the chip IPs. A silicon wiring substrate on which chip IPs can be mounted is provided. A circuit for a boundary scan test is formed on the silicon wiring substrate by connecting flip flops. The flip flops are connected to wiring and are arranged to test connections in the wiring. The entire IP On Super-Sub (IPOS) device or each chip IP may be arranged to facilitate a scan test, a built-in self-test (BIST), etc., on the internal circuit of the chip IP.