发明授权
- 专利标题： Method of manufacturing multilayered printed wiring board using adhesive film
- 专利标题（中）： 使用粘合膜制造多层印刷线路板的方法
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申请号： US09696179申请日： 2000-10-26
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公开(公告)号： US06739040B1公开(公告)日： 2004-05-25
- 发明人: Shigeo Nakamura , Tadahiko Yokota
- 申请人： Shigeo Nakamura , Tadahiko Yokota
- 优先权： JP11-307091 19991028; JP2000-205132 20000706
- 主分类号： H05K636
- IPC分类号： H05K636
摘要：
The present invention relates to a method of manufacturing a multilayered printed wiring board by a buildup system in which a conductive circuit layer and an insulating layer are alternately piled up. This method also involves using an adhesive film to facilitate manufacturing the multilayered printed wiring board having excellent surface smoothness at satisfactory yields.