发明授权
US06740979B1 Semiconductor device and LSI defect analyzing method using the same 失效
半导体器件和LSI缺陷分析

  • 专利标题: Semiconductor device and LSI defect analyzing method using the same
  • 专利标题(中): 半导体器件和LSI缺陷分析
  • 申请号: US09349927
    申请日: 1999-07-08
  • 公开(公告)号: US06740979B1
    公开(公告)日: 2004-05-25
  • 发明人: Itaru Tamura
  • 申请人: Itaru Tamura
  • 优先权: JP10-193939 19980709
  • 主分类号: H01L2348
  • IPC分类号: H01L2348
Semiconductor device and LSI defect analyzing method using the same
摘要:
First wirings are disposed along a straight line in one row or one column of memory cell arrays. A second wiring is disposed above the first wirings and transmits a signal from one end of the second wiring to the other end thereof. Contact plugs connect the first wirings and the second wiring to each other. The first wirings are connected to a plurality of successive memory cells among all the memory cells in the row or column to which the first wirings belong. In case such an LSI is manufactured and defect analysis is made to thereby form an FBM, it is decided that the contact plugs connecting the first wirings to the second wiring are disconnected when a plurality of successive memory cells in one row or one column. Thus, a plurality of defects are expressed by the use of different categories.
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