发明授权
- 专利标题： Substrate treatment process and apparatus
- 专利标题（中）： 基板处理工艺及装置
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申请号： US09742423申请日： 2000-12-22
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公开(公告)号： US06743301B2公开(公告)日： 2004-06-01
- 发明人: Kousaku Matsuno , Masao Iga
- 申请人： Kousaku Matsuno , Masao Iga
- 优先权： JP11/367923 19991224; JP2000/307029 20001006
- 主分类号： B08B300
- IPC分类号： B08B300
摘要：
A substrate treatment process is disclosed to remove organic matter existing on a substrate such as a wafer, glass substrate or ceramic. The process comprises treating the substrate with ozone water and then with hydrogen water, or treating the substrate with ozone-hydrogen water or treating the substrate with ozone water and hydrogen water at the same time.
公开/授权文献
- US20010009155A1 Substrate treatment process and apparatus 公开/授权日：2001-07-26
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