发明授权
- 专利标题: Semiconductor device and method for manufacturing the same
- 专利标题(中): 半导体装置及其制造方法
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申请号: US09785428申请日: 2001-02-20
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公开(公告)号: US06744066B2公开(公告)日: 2004-06-01
- 发明人: Kenji Shimoyama , Kazumasa Kiyomi , Hideki Gotoh , Satoru Nagao
- 申请人: Kenji Shimoyama , Kazumasa Kiyomi , Hideki Gotoh , Satoru Nagao
- 优先权: JP6-262837 19941026; JP6-262838 19941026; JP6-262839 19941026
- 主分类号: H01L2906
- IPC分类号: H01L2906
摘要:
The semiconductor device according to the present invention comprises a V-groove having V-shaped cross-section formed on a semiconductor substrate or on an epitaxial growth layer grown on a semiconductor substrate, and an active layer is provided only at the bottom of said V-groove. The method for manufacturing a semiconductor device according to the present invention comprises the steps of forming a stripe-like etching protective film in direction of a semiconductor substrate or an epitaxial growth layer grown on it, performing gas etching using hydrogen chloride as etching gas on a semiconductor substrate or on an epitaxial growth layer grown on a semiconductor substrate to form a V-groove, and forming an active layer at the bottom of said V-groove.
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