发明授权
- 专利标题: Heat dissipation device
- 专利标题(中): 散热装置
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申请号: US10323474申请日: 2002-12-20
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公开(公告)号: US06745824B2公开(公告)日: 2004-06-08
- 发明人: Hsieh Kun Lee , Chun-Chi Chen , Winsan Peng
- 申请人: Hsieh Kun Lee , Chun-Chi Chen , Winsan Peng
- 优先权: TW91208819U 20020613
- 主分类号: F28D1500
- IPC分类号: F28D1500
摘要:
A heat dissipation device includes a heat sink (20), heat pipes (30), a frame (40), and a fan (50). Each heat pipe has a lower first connecting portion (32) and an upper second connecting portion (34). The heat sink includes a base (21), and parallel fins (27) attached on the base. The base includes a top plate (25), and defines a hermetically sealed chamber. Apertures (23) are defined in one side wall (22) of the base, the apertures receiving the first connecting portions. Through holes (29) are transversely defined through the fins, the through holes receiving the second connecting portions. The frame includes an upper plate (41), and two side plates (47). Two arms (49) of each side plate secures the frame on the heat sink. In operation, working liquid in the chamber transfers heat to the top plate and to the second connecting portions by phase transition.
公开/授权文献
- US20030230398A1 HEAT DISSIPATION DEVICE 公开/授权日:2003-12-18
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