Invention Grant
- Patent Title: Electrospraying apparatus and method for coating particles
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Application No.: US10162031Application Date: 2002-06-03
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Publication No.: US06746869B2Publication Date: 2004-06-08
- Inventor: David Y. H. Pui , Da-Ren Chen
- Applicant: David Y. H. Pui , Da-Ren Chen
- Main IPC: C12N1588
- IPC: C12N1588

Abstract:
An electrospraying apparatus and/or method is used to coat particles. For example, a flow including at least one liquid suspension may be provided through at least one opening at a spray dispenser end. The flow includes at least particles and a coating material. A spray of microdroplets suspending at least the particles is established forward of the spray dispenser end by creating a nonuniform electrical field between the spray dispenser end and an electrode electrically isolated therefrom. The particles are coated with at least a portion of the coating material as the microdroplet evaporates. For example, the suspension may include biological material particles.
Public/Granted literature
- US20020150669A1 Electrospraying apparatus and method for coating particles Public/Granted day:2002-10-17
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