In some embodiments, the invention involves multiple integrated circuit stubs coupled in series. At least one of the integrated circuit stubs including first conductors to receive signals from a first adjacent one of the integrated circuit stubs, second conductors to provide signals to a second adjacent one of the integrated circuit stubs, and third conductors to provide signals to an integrated circuit chip. The integrated circuit stubs include first drivers and second drivers coupled to the first, second, and third conductors, wherein the first drivers receive the external signals from the first conductors and drive them onto the second conductors and the second drivers receive signals from the first conductors and drive them onto the third conductors.