Invention Grant
- Patent Title: Substrate bending stiffness measurement method and system
- Patent Title (中): 基体弯曲刚度测量方法及系统
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Application No.: US10440752Application Date: 2003-05-19
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Publication No.: US06748801B2Publication Date: 2004-06-15
- Inventor: Robert A. Clark
- Applicant: Robert A. Clark
- Main IPC: G01L504
- IPC: G01L504

Abstract:
A sheet separation and feeding system for measuring substrate bending stiffness and thereby basis weight on a real time basis. Provided is a corrugator having a plurality of parallel ribs, with one or more sheets of the substrate provided below the corrugator wherein a predetermined gap exists between a topmost sheet of the sheets and the corrugator. A vacuum is applied between the corrugator and the topmost sheet, wherein the vacuum is sufficiently large to raise the topmost sheet, thereby deflecting and bending it into a profile corresponding to the arrangement and size of the corrugator ribs and bending stiffness of the substrate. One or more sensors are provided for measuring the deflection of the topmost sheet. The vacuum, an air knife output and/or a fluffer output are then adjusted according to predetermined rules and the measured deflection.
Public/Granted literature
- US20030205093A1 Substrate bending stiffness measurement method and system Public/Granted day:2003-11-06
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