发明授权
- 专利标题： Method for producing mounting structure for an electronic component
- 专利标题（中）： 一种电子部件安装结构的制造方法
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申请号： US10409400申请日： 2003-04-07
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公开(公告)号： US06749889B2公开(公告)日： 2004-06-15
- 发明人: Hiroaki Takezawa , Tsutomu Mitani , Minehiro Itagaki , Yoshihiro Bessho , Kazuo Eda
- 申请人： Hiroaki Takezawa , Tsutomu Mitani , Minehiro Itagaki , Yoshihiro Bessho , Kazuo Eda
- 优先权： JP11-062759 19990310; JP11-155346 19990602
- 主分类号： B05D512
- IPC分类号： B05D512
摘要：
In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.
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