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公开(公告)号：US06749889B2
公开(公告)日：2004-06-15
申请号：US10409400
申请日：2003-04-07
IPC分类号： B05D512
CPC分类号： H05K3/321 , B32B7/02 , B32B7/12 , H05K2201/09909 , H05K2201/10636 , H05K2201/10984 , H05K2203/0783 , H05K2203/121 , Y02P70/611 , Y10S428/901 , Y10T29/4913 , Y10T29/49147 , Y10T428/24066 , Y10T428/24917 , Y10T428/2495 , Y10T428/24975 , Y10T428/269 , Y10T428/31678 , Y10T428/31681
摘要： In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.
摘要翻译： 在包括通过导电粘合剂彼此电连接的第一电极和第二电极的安装结构中，至少一个电极和导电粘合剂之间的粘合部分的周边被电绝缘层覆盖，由此附着 部分从外围加强。 电绝缘层可以通过将导电粘合剂的粘合剂树脂组分溶解在溶剂中而形成。 这增加了导电粘合剂中的导电填料的浓度，从而也增强了粘合部分的导电性。
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公开(公告)号：US06510059B2
公开(公告)日：2003-01-21
申请号：US09889523
申请日：2001-07-18
IPC分类号： H05K118
CPC分类号： H05K3/321 , C09J9/02 , H01L23/49883 , H01L2924/0002 , H05K3/305 , H05K2201/10636 , H05K2201/10977 , H05K2203/0278 , H05K2203/0783 , Y02P70/611 , Y10S205/925 , Y10T29/4913 , Y10T29/49146 , H01L2924/00
摘要： In mounting an electronic component using a conductive resin, a conductive resin containing a specific diluent component is used as the conductive resin, or a specific diluent component is applied to the conductive resin before being cured. This allows connection in a portion where an electrode (5) of an electronic component (4) and an electrode (2) of a circuit substrate (1) are opposed to each other to be provided via a resin (3a) containing a conductive filler as a main component, and allows connection at a lower surface of the electronic component (4) and connection in vicinities of the electrode (5) to be provided via a resin (3b, 3c) containing a binder resin as a main component that has oozed out of the conductive resin. The resin (3b, 3c) containing the binder resin as the main component increases junction strength.
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3.发明授权Conductive paste, its manufacturing method, and printed wiring board using the same 失效导电糊，其制造方法和使用其的印刷线路板公开(公告)号：US06488869B2
公开(公告)日：2002-12-03
申请号：US09056774
申请日：1998-04-08
IPC分类号： H01B102
CPC分类号： H05K1/095 , H01B1/22 , H05K3/321 , H05K3/4069 , H05K2201/10636 , H05K2203/121 , Y02P70/611 , Y10T428/24917 , Y10T428/3192
摘要： A conductive paste has conductive particles having metal particle surface coated with a complex of same metal of less than 10 nm in thickness and not having spontaneous oxide film on said metal particles, and a binder mainly composed of an insulating resin.
摘要翻译： 导电糊具有金属颗粒表面涂覆有厚度小于10nm且在所述金属颗粒上不具有自发氧化膜的相同金属的复合物的导电颗粒和主要由绝缘树脂构成的粘合剂。
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公开(公告)号：US06376051B1
公开(公告)日：2002-04-23
申请号：US09519984
申请日：2000-03-07
IPC分类号： B32B300
CPC分类号： H05K3/321 , B32B7/02 , B32B7/12 , H05K2201/09909 , H05K2201/10636 , H05K2201/10984 , H05K2203/0783 , H05K2203/121 , Y02P70/611 , Y10S428/901 , Y10T29/4913 , Y10T29/49147 , Y10T428/24066 , Y10T428/24917 , Y10T428/2495 , Y10T428/24975 , Y10T428/269 , Y10T428/31678 , Y10T428/31681
摘要： In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.
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5.发明授权公开(公告)号：US06814893B2
公开(公告)日：2004-11-09
申请号：US10613042
申请日：2003-07-07
IPC分类号： H01B122
CPC分类号： H01L24/83 , C09J9/02 , H01B1/22 , H01L23/49883 , H01L24/28 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/29439 , H01L2224/29444 , H01L2224/29499 , H01L2224/32225 , H01L2224/73204 , H01L2224/8319 , H01L2224/838 , H01L2924/00014 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/1579 , H01L2924/19041 , H01L2924/19043 , H01R4/04 , H05K3/321 , H05K13/0469 , H05K2201/0769 , H05K2201/10636 , H05K2201/10674 , H05K2203/121 , Y02P70/611 , Y10T428/2982 , Y10T428/2984 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/05599
摘要： A conductive adhesive agent of the invention contains an elution preventing film-forming agent 4, which becomes reactive after electric continuity through a conductive particle 3 appeared in the conductive adhesive agent when a binder resin 2 is being hardened, to thereby form an elution preventing film 5 on a surface of the conductive particle 3. By using this conductive adhesive agent, the packaging structure is made migration resistant and sulfurization resistant.
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公开(公告)号：US06675474B2
公开(公告)日：2004-01-13
申请号：US10309597
申请日：2002-12-03
IPC分类号： H05K1300
CPC分类号： H05K3/321 , H05K2201/0129 , H05K2201/10992 , H05K2203/176 , H05K2203/306 , Y10T29/49172
摘要： An electronic component mounted member includes a circuit board, an electronic component connected to the circuit board and an electrically conductive adhesive interposed between the electronic component and the circuit board. In a joining interface of the electrically conductive adhesive and an electrode of the circuit board, an intermediate layer that is formed of a thermoplastic insulating adhesive with a softening temperature of 100° C. to 300° C. is interposed between the electrically conductive adhesive and the electrode. An electrically conductive filler contained in the electrically conductive adhesive is present partially in the intermediate layer, thus allowing an electrical conduction between the electrically conductive adhesive and the electrode of the circuit board. This electronic component mounted member is used, and when a repair is necessary, a portion of the intermediate layer corresponding to the electronic component to be repaired is heated so as to raise a temperature of this portion to at least a melting point of the thermoplastic insulating adhesive, thereby melting the thermoplastic insulating adhesive. Then, the electronic component is removed with this state maintained.
摘要翻译： 电子部件安装部件包括电路板，连接到电路板的电子部件和插入在电子部件和电路板之间的导电粘合剂。 在导电粘合剂和电路板的电极的接合界面中，由软化温度为100℃至300℃的热塑性绝缘粘合剂形成的中间层介于导电粘合剂和 电极。 包含在导电粘合剂中的导电填料部分地存在于中间层中，从而允许导电粘合剂和电路板的电极之间的导电。 使用该电子部件安装部件，当需要修理时，对应于要修复的电子部件的中间层的一部分被加热，以将该部分的温度升高至热塑性绝缘体的至少熔点 粘合剂，从而熔化热塑性绝缘粘合剂。 然后，保持该状态，去除电子部件。
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公开(公告)号：US06666994B2
公开(公告)日：2003-12-23
申请号：US10309426
申请日：2002-12-03
IPC分类号： H01L2314
CPC分类号： H01B1/22 , C09J9/02 , H01L2924/181 , H05K3/321 , H05K3/323 , H05K2201/0272 , H05K2201/0769 , Y10T428/12069 , Y10T428/1209 , Y10T428/12111 , Y10T428/12139 , Y10T428/12528 , Y10T428/25 , H01L2924/00012
摘要： The present invention provides a conductive adhesive and a packaging structure that can keep moisture-proof reliability even when a multipurpose base metal electrode is used. A conductive adhesive according to the present invention includes first particles having a standard electrode potential that is equal to or higher than a standard electrode potential of silver, and second particles having a standard electrode potential lower than a standard electrode potential of silver. A metal compound coating having a potential higher than that of metal particles as the first particles can be formed on a surface of an electrode having a potential lower than that of the metal particles.
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公开(公告)号：US06429382B1
公开(公告)日：2002-08-06
申请号：US09547922
申请日：2000-04-11
IPC分类号： H05K102
CPC分类号： H01L24/83 , H01L23/4828 , H01L23/49883 , H01L24/29 , H01L2224/04026 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/13019 , H01L2224/13099 , H01L2224/16 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29439 , H01L2224/29499 , H01L2224/73204 , H01L2224/8319 , H01L2224/838 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/15787 , H01L2924/1579 , H01L2924/19041 , H01L2924/19043 , H01L2924/351 , H05K3/321 , H05K3/323 , H05K2201/0769 , H05K2201/10636 , H05K2201/10674 , H05K2203/121 , Y02P70/611 , H01L2924/00014 , H01L2924/00 , H01L2924/0105 , H01L2924/00012 , H01L2224/05644
摘要： For the reliability in insulation and against sulfurization, the mounting structure of the invention includes an electric structure, and an electrically conductive adhesive layer including an electrically conductive filler disposed on the electric structure, and at least a portion of surface of the electrically conductive filler is exposed to an external environment, and an elution preventive film is disposed on at least a portion of the exposed surface. Further, an electrically conductive adhesive of this invention includes the electrically conductive filler, and an elution preventive film is disposed on the entire surface of the electrically conductive filler.
摘要翻译： 为了绝缘和耐硫化的可靠性，本发明的安装结构包括电结构，以及包括设置在电结构上的导电填料的导电粘合剂层，并且导电填料表面的至少一部分是 暴露在外部环境中，并且防洗掉膜被设置在暴露表面的至少一部分上。 此外，本发明的导电性粘合剂包括导电填料，并且在导电填料的整个表面上设置防淘汰膜。
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公开(公告)号：US07755893B2
公开(公告)日：2010-07-13
申请号：US11816650
申请日：2006-03-15
申请人： Hiroto Yanagawa , Hiroaki Takezawa
发明人： Hiroto Yanagawa , Hiroaki Takezawa
CPC分类号： H05K7/20009 , H05K7/20972 , Y10S345/905
摘要： The present invention provides a display apparatus that can achieve high durability by making the most of the function of the exhaust fans to effectively suppress the rise of the temperature. The display apparatus comprises a display panel for displaying images, a rear case covering a rear side of the display panel, and an exhaust fan disposed within the rear case, wherein the rear case includes a first air-hole area and a second air-hole area each provided with a plurality of air holes, the first air-hole area is located at a higher level than the second air-hole area with respect to a vertical direction with a spacing therebetween, and at least partially faces the exhaust fan, and an area surrounded by the first air-hole area, the second air-hole area and external common tangents thereof is a shielded area in which no air hole is provided.
摘要翻译： 本发明提供一种显示装置，通过充分利用排气风扇的功能能够有效地抑制温度上升，能够实现高耐久性。 显示装置包括用于显示图像的显示面板，覆盖显示面板的后侧的后壳和设置在后壳体内的排气扇，其中后壳包括第一气孔区域和第二气孔 所述第一气孔区域相对于垂直方向位于比所述第二气孔区域更高的高度，其间具有间隔，并且至少部分地面对所述排风扇，并且 由第一气孔区域，第二气孔区域和外部共同切线围绕的区域是不设置空气孔的屏蔽区域。
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公开(公告)号：US07705536B2
公开(公告)日：2010-04-27
申请号：US10594155
申请日：2006-01-25
IPC分类号： H01J17/49
CPC分类号： H05K7/20972 , H05K7/20963
摘要： A display device is provided which is capable of inhibiting a localized elevation in the temperature of a casing thereby uniformalizing the surface temperature distribution over the casing. A display device includes: a display panel having surface arrays of plural pixels for displaying an image by light radiation control on a pixel to pixel basis; an electronic component forming a control circuit configured to perform the light radiation control; a casing housing the display panel and the electronic component therein; and a flat heat-conductive sheet interposed between the display panel and the casing and between the electronic component and the casing.
摘要翻译： 提供一种显示装置，其能够抑制壳体的温度的局部升高，从而使壳体上的表面温度分布均匀化。 显示装置包括：显示面板，具有多个像素的表面阵列，用于通过基于像素到像素的光辐射控制来显示图像; 形成控制电路的电子部件，被配置为执行所述光辐射控制; 将所述显示面板和所述电子部件容纳在其中的壳体; 以及介于所述显示面板和所述壳体之间以及所述电子部件与所述壳体之间的平坦的导热片。
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