发明授权
US06750422B2 Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole
有权
用激光制作通孔的方法，适合制作孔的覆铜层压板，以及用于制作孔的辅助材料
- 专利标题： Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole
- 专利标题（中）： 用激光制作通孔的方法，适合制作孔的覆铜层压板，以及用于制作孔的辅助材料
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申请号： US10028734申请日： 2001-12-28
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公开(公告)号： US06750422B2公开(公告)日： 2004-06-15
- 发明人: Morio Gaku , Nobuyuki Ikeguchi , Yasuo Tanaka , Yoshihiro Kato
- 申请人： Morio Gaku , Nobuyuki Ikeguchi , Yasuo Tanaka , Yoshihiro Kato
- 优先权： JP10-68357 19980318; JP10-140472 19980507; JP10-145205 19980512; JP10-145206 19980512; JP10-166324 19980529; JP10-167759 19980601; JP10-167760 19980601; JP10-216411 19980715; JP10-250447 19980820
- 主分类号： B23K2600
- IPC分类号： B23K2600
摘要：
A method of making a small-diameter through hole having high reliability with regard to a hole wall at a high rate with the energy of a high-output carbon dioxide gas laser without pre-making any hole in a copper foil, forming or disposing a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900° C. and a bond energy of at least 300 KJ/mol on at least a copper foil surface to be irradiated with the carbon dioxide gas laser, and irradiating a surface thereof with necessary pulses of the carbon dioxide gas laser to form the penetration hole, and an auxiliary material for use when a penetration hole is made in the copper-clad laminate with a carbon dioxide gas laser, the auxiliary material being a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900° C. and a bond energy of at least 300 KJ/mol.