Invention Grant
- Patent Title: Bending method and bending system
- Patent Title (中): 弯曲方法和弯曲系统
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Application No.: US10320689Application Date: 2002-12-17
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Publication No.: US06751993B2Publication Date: 2004-06-22
- Inventor: Katsuji Sekita , Tadahiko Nagasawa
- Applicant: Katsuji Sekita , Tadahiko Nagasawa
- Priority: JP9-351638 19971219
- Main IPC: B21D502
- IPC: B21D502
Abstract:
A bending method is provided for bending two sides of a workpiece to form flanges. The bending method includes measuring a bent flange to obtain a flange dimension. The bending method also includes setting a back gauge value for processing another flange, based on a measured dimension of the workpiece. The other flange is bent using the set back gauge value.
Public/Granted literature
- US20030084702A1 Bending method and bending system Public/Granted day:2003-05-08
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