In an IC socket of an open top type having a plurality of pin type contacts for electrical connection with an IC package inserted thereinto, the IC socket includes a socket body having a base plate, a vertically movable cover, a platform attached to the base plate and having an IC package mounting portion, and edge moving mechanisms each having a latch lever for holding the IC package placed on the platform and adapted to move the IC package from one side to the opposite side for adjusting and correcting the position of the IC package.