A semiconductor package is provided that includes an electrical connection and support means having a front face and a recess in the front face. The semiconductor package also includes a semiconductor component having a front face including a sensor and a rear face which presses on the bottom of the recess of the electrical connection and support means. Further included in the semiconductor package is a positioning and locking means for locking the semiconductor component onto the electrical connection and support means. The positioning and locking means is engaged in a space which separates the periphery of the semiconductor component from the periphery of the recess and keeps the semiconductor component pressed against the bottom of the recess. Thus, there is provided a semiconductor package having efficiently oriented components.