公开(公告)号：US07288843B2

公开(公告)日：2007-10-30

申请号：US10470320

申请日：2002-01-24

Applicant: Christophe Prior ,  Laurent Herard

Inventor： Christophe Prior ,  Laurent Herard

IPC: H01L23/22

CPC classification number: H01L21/565 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A substrate, in particular, a multilayer substrate, includes a mounting and electrical-connection support, and a face for mounting at least one integrated circuit chip (IC chip). The substrate and the mounted IC chip are placed in an injection mold. The injection mold has two parts that surround the periphery of the substrate. One part of the injection mold defines a cavity for molding an encapsulation material thereby encapsulating the IC chip, and includes a face for bearing on the mounting face. At least one recess is provided in one part of the injection mold. The recess defines, above the mounting face, a slot for providing a vent for venting gases. The mounting face includes a region on which a metal outer layer is placed. The metal outer layer extends along the recess and on the bearing face on both sides of the recess.

Abstract translation: 基板，特别是多层基板，包括安装和电连接支撑件，以及用于安装至少一个集成电路芯片（IC芯片）的面。 将基板和安装的IC芯片放置在注射模具中。 注射模具具有围绕基材周边的两部分。 注射模具的一部分限定了用于模制封装材料的空腔，从而封装IC芯片，并且包括用于在安装面上承受的面。 在注射模具的一部分中设置至少一个凹部。 该凹部在安装面上方限定用于提供用于排出气体的通风口的槽。 安装面包括放置金属外层的区域。 金属外层沿凹槽和凹槽两侧的支承面延伸。

公开(公告)号：US06858933B2

公开(公告)日：2005-02-22

申请号：US09862984

申请日：2001-05-22

Applicant: Jonathan Abela ,  Christophe Prior

Inventor： Jonathan Abela ,  Christophe Prior

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/02

CPC classification number: H01L21/565 ,  H01L23/3107 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  H01L2924/00014

Abstract: An injection mold is provided for encapsulating an integrated circuit chip to form a semiconductor package. The injection mold includes at least one injection cavity for housing the chip, and an insert having a front part that forms part of the wall of the injection cavity. A transverse surface of the insert has a roughness that is chosen such that the face of the semiconductor package has a suitable roughness in a corresponding region. Also provided is a semiconductor package that includes an encapsulation block and an integrated circuit chip. The material of the encapsulation block is transparent. One face of the chip includes an optical sensor and lies parallel to a transverse face of the encapsulation block. The transverse face of the encapsulation block includes a region that has a roughness that is less than the roughness of at least the rest of the transverse face.

Abstract translation: 提供一种用于封装集成电路芯片以形成半导体封装的注塑模具。 注射模具包括用于容纳芯片的至少一个注射腔和具有形成注射腔的壁的一部分的前部的插入件。 插入件的横向表面具有粗糙度，其被选择为使得半导体封装的表面在相应区域中具有合适的粗糙度。 还提供了包括封装块和集成电路芯片的半导体封装。 封装块的材质是透明的。 芯片的一个面包括光学传感器，并且平行于封装块的横向面。 封装块的横向面包括具有小于至少其余横向面的粗糙度的粗糙度的区域。

公开(公告)号：US07029952B2

公开(公告)日：2006-04-18

申请号：US10466900

申请日：2002-01-21

Applicant: Christophe Prior

Inventor： Christophe Prior

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L21/50 ,  H01L23/055 ,  H01L23/49816 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Method of fabricating a semiconductor package and semiconductor package containing an integrated circuit chip having, on one front face, electrical connection regions, in which a first multilayer plate (2) comprising an assembly face (2a) is furnished with an adhesive layer (8) and which has through-holes (9); and a second plate (3) has a recess (13) made in one assembly face (3a) fastened to the assembly face of the first plate via the said adhesive layer; the said chip (4) being placed in the said recess in a position such that its front face is fastened to the assembly face of the first plate via the said adhesive layer and that its electrical connection regions are located facing the through-holes of this first plate, and the bottom of the recess of the said second plate bearing against the rear face of the chip opposite the front face.

Abstract translation: 制造半导体封装件和半导体封装件的方法，所述半导体封装件和半导体封装件包含集成电路芯片，所述集成电路芯片在一个正面上具有电连接区域，其中包括组装面（2a）的第一多层板（2）配备有粘合层 ），并具有通孔（9）; 并且第二板（3）具有通过所述粘合剂层固定到所述第一板的组装面的一个组装面（3a）中形成的凹部（13） 所述芯片（4）被放置在所述凹部中，使得其前表面经由所述粘合剂层紧固到第一板的组装面，并且其电连接区域面向该第一板的通孔定位 第一板，并且所述第二板的凹部的底部抵靠与前表面相对的芯片的后表面。

公开(公告)号：US06995033B2

公开(公告)日：2006-02-07

申请号：US10470174

申请日：2002-01-18

Applicant: Christophe Prior

Inventor： Christophe Prior

IPC: H01L21/00

CPC classification number: H01L31/0203 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14683 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2224/05599

Abstract: Method of fabricating an optical semiconductor package and optical semiconductor package containing an integrated circuit chip having on a front face an optical sensor and electrical connection regions distributed around this sensor, in which a transparent patch (6) lies in front of the front face of the chip without covering the electrical connection regions of this chip, plates (2, 7) defining between them a cavity (10) in which the said chip and the said patch are stacked and which have annular assembly faces (2a, 7a), electrical connection pads (15) are placed between the said electrical connection regions and one face (12) of the said cavity, electrical connection tracks (14) are carried by a plate (7) and lie on the said face (12) of the cavity in order to be in contact with the said pads, an adhesive layer (18) flying between the said assembly faces (2a, 7a), the said tracks (14) protruding in order to pass between the assembly faces of the said plates with a view to external connections and the plate located at the side of the said patch comprising an aperture located opposite the optical sensor.

Abstract translation: 制造光半导体封装的方法和包含集成电路芯片的光学半导体封装的方法，所述集成电路芯片在正面上具有分布在该传感器周围的光学传感器和电连接区域，其中透明贴片（6）位于 芯片，而不覆盖该芯片的电连接区域，在它们之间限定了空腔（10）的板（2,7），其中所述芯片和所述贴片堆叠在其中，并且具有环形组装面（2a，7a） 电连接焊盘（15）被放置在所述电连接区域和所述空腔的一个面（12）之间，电连接轨道（14）由板（7）承载并且位于所述腔的所述面（12）上 空腔以与所述垫接触，在所述组装面（2a，7a）之间飞行的粘合剂层（18），所述轨道（14）突出以便在所述组件面 盘子 以及位于所述贴片侧面的板，其包括与光学传感器相对的孔。

公开(公告)号：US07095123B2

公开(公告)日：2006-08-22

申请号：US10466191

申请日：2002-01-10

Applicant: Christophe Prior

Inventor： Christophe Prior

IPC: H01L23/28

CPC classification number: H01L31/0203 ,  H01L21/565 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1815 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package includes a mounting and electrical connection plate, and a semiconductor component having front and rear surfaces and including a sensor. The rear surface of the semiconductor component is attached to the mounting and electrical connection plate and the front surface is attached to the sensor. An insert is adjacent the front face of the semiconductor component and the sensor and has an access passage for exposing the sensor. A plug is in the access passage of the insert. A body of encapsulation material surrounds the mounting and electrical connection plate, the semiconductor component and the insert.

Abstract translation: 半导体封装包括安装和电连接板，以及具有前表面和后表面并且包括传感器的半导体部件。 半导体部件的后表面附接到安装和电连接板，并且前表面附接到传感器。 插入件与半导体部件和传感器的前表面相邻，并且具有用于暴露传感器的通路。 塞子位于插入件的通道中。 封装材料体围绕安装和电连接板，半导体部件和插入件。

公开(公告)号：US06972497B2

公开(公告)日：2005-12-06

申请号：US10359049

申请日：2003-02-05

Applicant: Christophe Prior

Inventor： Christophe Prior

IPC: H01L23/28 ,  H01L23/34 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18

CPC classification number: H04N5/2254 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An optical semiconductor product includes an integrated circuit chip having an optical sensor in its front face. The chip is attached to a support plate and electrical interconnection is made therebetween. A protective ring is fastened to the front face of the chip, around and at some distance from the optical sensor. A ring of encapsulating material is deposited to surround the periphery of the chip and lie between the front face of the support plate (2) and the protective ring.

Abstract translation: 光学半导体产品包括在其正面具有光学传感器的集成电路芯片。 芯片连接到支撑板，并且在它们之间形成电互连。 保护环紧固在芯片的前表面上，距离光学传感器约一定距离。 沉积环形密封材料环绕芯片的周边并位于支撑板（2）的前表面和保护环之间。

公开(公告)号：US06885088B2

公开(公告)日：2005-04-26

申请号：US10371397

申请日：2003-02-20

Applicant: Jean-Luc Diot ,  Christophe Prior ,  Jérome Teysseyre ,  Jean-Pierre Moscicki

Inventor： Jean-Luc Diot ,  Christophe Prior ,  Jérome Teysseyre ,  Jean-Pierre Moscicki

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/495

CPC classification number: H01L21/565 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The leadframe has a perforation to form, between a central platform and a peripheral part located a certain distance apart, radiating elongate leads. The leadframe has, on its rear face that comes into contact with a bearing surface of a mold, at least one recess and a groove for connecting this recess to the perforation.

Abstract translation: 引线框架具有在中心平台和位于一定距离之间的周边部分之间形成穿孔，辐射细长的引线。 所述引线框在其与所述模具的支承表面接触的后表面上具有至少一个凹部和用于将所述凹部连接到所述穿孔的凹槽。

公开(公告)号：US06759718B2

公开(公告)日：2004-07-06

申请号：US10298189

申请日：2002-11-14

Applicant: Christophe Prior

Inventor： Christophe Prior

IPC: H01L2976

CPC classification number: H01L27/14618 ,  H01L24/32 ,  H01L24/83 ,  H01L31/0203 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/12043 ,  H01L2924/16195 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package is provided that includes an electrical connection and support means having a front face and a recess in the front face. The semiconductor package also includes a semiconductor component having a front face including a sensor and a rear face which presses on the bottom of the recess of the electrical connection and support means. Further included in the semiconductor package is a positioning and locking means for locking the semiconductor component onto the electrical connection and support means. The positioning and locking means is engaged in a space which separates the periphery of the semiconductor component from the periphery of the recess and keeps the semiconductor component pressed against the bottom of the recess. Thus, there is provided a semiconductor package having efficiently oriented components.

Abstract translation: 提供一种半导体封装，其包括电连接和支撑装置，其具有正面和前表面中的凹部。 半导体封装还包括半导体部件，其具有包括传感器的前表面和压在电连接和支撑装置的凹部的底部上的后表面。 还包括在半导体封装中的是用于将半导体部件锁定到电连接和支撑装置上的定位和锁定装置。 定位和锁定装置接合在将半导体部件的周边与凹部的周边分开的空间中，并使半导体部件压靠凹部的底部。 因此，提供了具有有效取向的部件的半导体封装。