Invention Grant
US06762121B2 Method of forming refractory metal contact in an opening, and resulting structure
失效
在开口中形成难熔金属接触的方法,以及结果
- Patent Title: Method of forming refractory metal contact in an opening, and resulting structure
- Patent Title (中): 在开口中形成难熔金属接触的方法,以及结果
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Application No.: US09826036Application Date: 2001-04-04
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Publication No.: US06762121B2Publication Date: 2004-07-13
- Inventor: Jonathan D. Chapple-Sokol , Randy W. Mann , William J. Murphy , Jed H. Rankin , Daniel S. Vanslette
- Applicant: Jonathan D. Chapple-Sokol , Randy W. Mann , William J. Murphy , Jed H. Rankin , Daniel S. Vanslette
- Main IPC: C23C1434
- IPC: C23C1434

Abstract:
A method of ensuring against deterioration of an underlying silicide layer over which a refractory material layer is deposited by physical vapor deposition (PVD) or chemical vapor deposition (CVD) is realized by first providing a continuous polysilicon layer prior to the refractory material deposition. The continuous polysilicon layer, preferably no thicker than 50 Å, serves a sacrificial purpose and prevents interaction between any fluorine that is released during the refractory material deposition step from interacting with the underlying silicide.
Public/Granted literature
- US20030165705A1 Method of forming refractory metal contact in an opening, and resulting structure Public/Granted day:2003-09-04
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