发明授权
- 专利标题： Wiring-connecting material and process for producing circuit board with the same
- 专利标题（中）： 接线材料及其制造方法与电路板相同
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申请号： US10069053申请日： 2002-07-08
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公开(公告)号： US06762249B1公开(公告)日： 2004-07-13
- 发明人: Tohru Fujinawa , Masami Yusa , Satoyuki Nomura , Hiroshi Ono , Itsuo Watanabe , Motohiro Arifuku , Hoko Kanazawa
- 申请人： Tohru Fujinawa , Masami Yusa , Satoyuki Nomura , Hiroshi Ono , Itsuo Watanabe , Motohiro Arifuku , Hoko Kanazawa
- 优先权： JP11-238409 19990825; JP2000-092978 20000328
- 主分类号： C08G1862
- IPC分类号： C08G1862
摘要：
The present invention provides a wiring-connecting material comprising from 2 to 75 parts by weight of a polyurethane resin, from 30 to 60 parts by weight of a radical-polymerizable substance and from 0.1 to 30 parts by weight of a curing agent capable of generating a free radical upon heating, and a process for producing a wiring-connected board by using the wiring-connecting material. The wiring-connecting material of the present invention may preferably further contain a film-forming material and/or conductive particles.
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