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US06762443B2 Vertical transistor and transistor fabrication method 失效
垂直晶体管和晶体管制造方法

  • 专利标题: Vertical transistor and transistor fabrication method
  • 专利标题(中): 垂直晶体管和晶体管制造方法
  • 申请号: US10298834
    申请日: 2002-11-18
  • 公开(公告)号: US06762443B2
    公开(公告)日: 2004-07-13
  • 发明人: Rolf Weis
  • 申请人: Rolf Weis
  • 优先权: DE10024876 20000516
  • 主分类号: H01L27148
  • IPC分类号: H01L27148
Vertical transistor and transistor fabrication method
摘要:
In DRAM memory cells, individual memory cells are isolated from one another by an isolation trench (STI). In such a case, a vertical transistor is formed by the isolation trench as SOI transistor because its channel region is isolated from a substrate by the isolation trench. A vertical transistor that is used, for example, in a DRAM memory cell and a method for making the transistor includes connecting the channel region of the vertical transistor to the substrate by disposing a conductive layer in the isolation trench between a lower insulation filling and an upper insulation filling.
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