发明授权
- 专利标题: Microwave integrated circuit
- 专利标题(中): 微波集成电路
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申请号: US10385525申请日: 2003-03-12
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公开(公告)号: US06762493B2公开(公告)日: 2004-07-13
- 发明人: Haruo Kojima , Tomoyuki Kitani
- 申请人: Haruo Kojima , Tomoyuki Kitani
- 优先权: JPP2002-087509 20020327
- 主分类号: H01L2334
- IPC分类号: H01L2334
摘要:
A microwave integrated circuit, includes: a dielectric substrate having a signal line on a front surface of the dielectric substrate and a mount pad disposed adjacent to an end of the signal line in a longitudinal direction of the signal line; a semiconductor chip having an upper electrode and a lower electrode provided on opposite surfaces of the semiconductor chip, the lower electrode being mounted on the mount pad; a bonding block connecting a bottom surface of the bonding block to the end in the longitudinal direction of the signal line; and a wiring member configured to bond the upper electrode of the semiconductor chip and a top surface of the bonding block together.
公开/授权文献
- US20030183927A1 Microwave integrated circuit 公开/授权日:2003-10-02