发明授权
- 专利标题: Transducer and a bonding apparatus using the same
- 专利标题(中): 传感器和使用该传感器的接合装置
-
申请号: US10234777申请日: 2002-09-04
-
公开(公告)号: US06766936B2公开(公告)日: 2004-07-27
- 发明人: Ryuichi Kyomasu , Osamu Kakutani , Yoshihiko Seino
- 申请人: Ryuichi Kyomasu , Osamu Kakutani , Yoshihiko Seino
- 优先权: JP2001-272001 20010907
- 主分类号: B23K520
- IPC分类号: B23K520
摘要:
A transducer vibrated by a vibrator and used in a bonding apparatus, the transducer including holding portions and connecting portions. The holding portions are provided so as to protrude at at least two locations that correspond to the nodes of vibration of a transducer main body, and the connecting portions each connects the tip ends of two protruding holding portions to each other. The external force applied to one of the holding portions is thus dispersed in each of the respective holding portions connected by the connecting portions, deformation of the holding portions is prevented, and the respective holding portions can be formed extremely thin in the axial direction of the transducer main body.
公开/授权文献
- US20030047583A1 Transducer and a bonding apparatus using the same 公开/授权日:2003-03-13
信息查询