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23 条记录 (耗时 0.016 秒)

    Transducer and a bonding apparatus using the same
    1.
    发明授权
    Transducer and a bonding apparatus using the same 失效
    传感器和使用该传感器的接合装置

    公开(公告)号：US06766936B2

    公开(公告)日：2004-07-27

    申请号：US10234777

    申请日：2002-09-04

    申请人： Ryuichi Kyomasu ,  Osamu Kakutani ,  Yoshihiko Seino

    发明人： Ryuichi Kyomasu ,  Osamu Kakutani ,  Yoshihiko Seino

    IPC分类号： B23K520

    CPC分类号： H01L24/78 ,  B06B3/00 ,  H01L2224/78 ,  H01L2224/78301 ,  H01L2224/78308 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2924/00

    摘要： A transducer vibrated by a vibrator and used in a bonding apparatus, the transducer including holding portions and connecting portions. The holding portions are provided so as to protrude at at least two locations that correspond to the nodes of vibration of a transducer main body, and the connecting portions each connects the tip ends of two protruding holding portions to each other. The external force applied to one of the holding portions is thus dispersed in each of the respective holding portions connected by the connecting portions, deformation of the holding portions is prevented, and the respective holding portions can be formed extremely thin in the axial direction of the transducer main body.

    摘要翻译： 传感器由振动器振动并用于粘合装置中，换能器包括保持部分和连接部分。 保持部设置成在与换能器主体的振动的节点对应的至少两个位置处突出，并且连接部分将两个突起保持部分的前端彼此连接。 因此，施加到一个保持部分的外力分散在由连接部分连接的每个保持部分中，防止了保持部分的变形，并且各个保持部分可以在 传感器主体。

    Manufacturing apparatus
    3.
    发明授权
    Manufacturing apparatus 失效
    制造设备

    公开(公告)号：US4674670A

    公开(公告)日：1987-06-23

    申请号：US762823

    申请日：1985-08-06

    申请人： Kenji Watanabe ,  Isamu Yamazaki ,  Ryuichi Kyomasu ,  Nobuhiro Takasugi ,  Tsutomu Mimata ,  Osamu Kakutani

    发明人： Kenji Watanabe ,  Isamu Yamazaki ,  Ryuichi Kyomasu ,  Nobuhiro Takasugi ,  Tsutomu Mimata ,  Osamu Kakutani

    IPC分类号： B23K20/00 ,  H01L21/00 ,  B23K1/00

    CPC分类号： H01L24/78 ,  B23K20/005 ,  H01L21/67144 ,  H01L21/67248 ,  H01L21/67259 ,  H01L2224/78 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082

    摘要： The invention relates to a manufacturing apparatus which comprises moving means which continuously moves the works that are transferred along a frame chute, and detector means which detects at least a portion of the work that is moved. The moving means is controlled by kind-of-work data and by a work position signal from the detector means, and the work is set to a predetermined position. Hence, even a work of a different kind can be set to an optimum bonding position without the need of exchanging the unit, making it possible to perform the operation fully automatically and to meet general purposes.Further, provision is made of means which moves the frame chute in a direction at right angles with the direction in which the work is moved, so that even that work that has different widths and shapes in the widthwise direction can be placed in position and subjected to the bonding fully automatically.The detector means can be provided not only at the bonding position but also at a position on the upstream side having a relation relative to the bonding position.The invention can be adapted particularly effectively to a wire bonder and a pellet bonder.

    摘要翻译： 本发明涉及一种制造装置，其包括连续地移动沿着框架槽传送的工件的移动装置和检测至少一部分被移动的工件的检测器装置。 移动装置由工作数据和来自检测装置的工作位置信号控制，工件被设定到预定位置。 因此，即使不同种类的工作也可以被设定为最佳的结合位置，而不需要更换单元，使得可以完全自动地执行操作并且达到一般目的。 此外，提供了使框架滑槽沿与工件移动方向成直角的方向移动的装置，使得即使在宽度方向上具有不同宽度和形状的工件也可以被放置就位 完全自动粘接。 检测器装置不仅可以在接合位置处设置，而且还可以设置在上游侧的位置，具有相对于接合位置的关系。 本发明可以特别有效地适用于焊线机和颗粒接合机。

    Manufacturing method
    4.
    发明授权
    Manufacturing method 失效
    制造方法

    公开(公告)号：US4763827A

    公开(公告)日：1988-08-16

    申请号：US38939

    申请日：1987-04-16

    申请人： Kenji Watanabe ,  Isamu Yamazaki ,  Ryuichi Kyomasu ,  Nobuhiro Takasugi ,  Tsutomu Mimata ,  Osamu Kakutani

    发明人： Kenji Watanabe ,  Isamu Yamazaki ,  Ryuichi Kyomasu ,  Nobuhiro Takasugi ,  Tsutomu Mimata ,  Osamu Kakutani

    IPC分类号： B23K20/00 ,  H01L21/00 ,  B23K31/00

    CPC分类号： H01L24/78 ,  B23K20/005 ,  H01L21/67144 ,  H01L21/67248 ,  H01L21/67259 ,  H01L2224/78 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082

    摘要： The invention relates to a manufacturing apparatus which comprises moving means which continuously moves the works that are transferred along a frame chute, and detector means which detects at least a portion of the work that is moved. The moving means is controlled by kind-of-work data and by a work position signal from the detector means, and the work is set to a predetermined position. Hence, even a work of a different kind can be set to an optimum bonding position without the need of exchanging the unit, making it possible to perform the operation fully automatically and to meet general purposes.Further, provision is made of means which moves the frame chute in a direction at right angles with the direction in which the work is moved, so that even that work that has different widths and shapes in the widthwise direction can be placed in position and subjected to the bonding fully automatically.The detector means can be provided not only at the bonding position but also at a position on the upstream side having a relation relative to the bonding position.The invention can be adapted particularly effectively to a wire bonder and a pellet bonder.

    摘要翻译： 本发明涉及一种制造装置，其包括连续地移动沿着框架槽传送的工件的移动装置和检测至少一部分被移动的工件的检测器装置。 移动装置由工作数据和来自检测装置的工作位置信号控制，工件被设定到预定位置。 因此，即使不同种类的工作也可以被设定为最佳的结合位置，而不需要更换单元，使得可以完全自动地执行操作并且达到一般目的。 此外，提供了使框架滑槽沿与工件移动方向成直角的方向移动的装置，使得即使在宽度方向上具有不同宽度和形状的工件也可以被放置就位 完全自动粘接。 检测器装置不仅可以在接合位置处设置，而且还可以设置在上游侧的位置，具有相对于接合位置的关系。 本发明可以特别有效地适用于引线接合机和颗粒接合机。

    XY table for a semiconductor manufacturing apparatus
    5.
    发明授权
    XY table for a semiconductor manufacturing apparatus 有权
    用于半导体制造装置的XY工作台

    公开(公告)号：US06727666B2

    公开(公告)日：2004-04-27

    申请号：US10133535

    申请日：2002-04-26

    申请人： Ryuichi Kyomasu ,  Hiroto Urabayashi ,  Minoru Torihata ,  Kuniyuki Takahashi ,  Toshimichi Miyahara

    发明人： Ryuichi Kyomasu ,  Hiroto Urabayashi ,  Minoru Torihata ,  Kuniyuki Takahashi ,  Toshimichi Miyahara

    IPC分类号： H02P780

    CPC分类号： H01L21/6835 ,  G05B2219/41205 ,  G05B2219/45026 ,  G05B2219/49266

    摘要： An XY table used in a semiconductor manufacturing apparatus including lower (X table) fixed to an X movable element and an upper table (Y table) fixed to a Y movable element, in which the upper table (Y table) is supported movably in a Y direction and immovably in an X direction on the lower table (X table), the X movable element is immovable in the Y direction with respect to the X motor main body, the Y movable element is movable in the X direction with respect to the Y motor main body. Furthermore, the Y motor main body is provided with a permanent magnet that covers an entire region of movement of a magnetic action component (coils) of the Y movable element in the X direction.

    摘要翻译： 一种用于半导体制造装置的XY工作台，其包括固定到X可移动元件的下部（X工作台）和固定到Y可移动元件的上部工作台（Y工作台），其中上部工作台（Y工作台）可移动地支撑在Y Y方向并且在X台上在X方向上不可移动，X可移动元件相对于X电动机主体在Y方向上不可移动，Y可移动元件可相对于X方向在X方向上移动 Y电机主体。 此外，Y电动机主体设置有永磁体，该永久磁铁覆盖Y方向上的Y可移动元件的磁作用部件（线圈）的整个移动区域。