发明授权
- 专利标题: Method of forming a silicon nitride-silicon dioxide gate stack
- 专利标题(中): 形成氮化硅 - 二氧化硅栅极叠层的方法
-
申请号: US10187704申请日: 2002-07-02
-
公开(公告)号: US06767847B1公开(公告)日: 2004-07-27
- 发明人: Chien-Ming Hu , Chien-Hao Chen , Mo-Chiun Yu , Shih-Chang Chen , Mong-Song Liang
- 申请人: Chien-Ming Hu , Chien-Hao Chen , Mo-Chiun Yu , Shih-Chang Chen , Mong-Song Liang
- 主分类号: H01L21324
- IPC分类号: H01L21324
摘要:
A method of forming a silicon nitride-silicon dioxide composite insulator layer for use as a gate insulator stack for an MOSFET device, has been developed. The method features formation of the silicon dioxide component of the gate insulator stack, after formation of the overlying silicon nitride component, allowing the gate insulator stack to be comprised with a nitrogen profile presenting enhanced barrier characteristic and less interface charge than counterpart silicon nitride-silicon dioxide composites formed wherein the silicon nitride component was deposited on an already grown underlying silicon dioxide layer. Oxygen ions, or oxygen radicals obtained via ultra-violet procedures, penetrate the silicon nitride component and locate in a top portion of the semiconductor substrate. Subsequent annealing allows reaction of the oxygen ions or radicals with a top portion of the semiconductor substrate resulting in the desired silicon dioxide component underlying silicon nitride.
信息查询