Invention Grant
- Patent Title: Thermal transfer of microstructured layers
- Patent Title (中): 微结构层的热转移
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Application No.: US10356047Application Date: 2003-01-31
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Publication No.: US06770337B2Publication Date: 2004-08-03
- Inventor: Mark K. Debe , Martin B. Wolk
- Applicant: Mark K. Debe , Martin B. Wolk
- Main IPC: B41M530
- IPC: B41M530

Abstract:
Articles having a component with a surface defining microstructured features can be formed using thermal transfer elements. One example of a suitable thermal transfer element includes a microstructured layer having a surface defining microstructured features imposed on the microstructured layer. The thermal transfer element is configured and arranged for the transfer of at least a portion of the microstructured layer to a receptor while substantially preserving the microstructured features of that portion.
Public/Granted literature
- US20030138555A1 Thermal transfer of microstructured layers Public/Granted day:2003-07-24
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