Automated method of attaching flip chip devices to a substrate

发明授权

US06773523B2 Automated method of attaching flip chip devices to a substrate 失效

标题翻译：将倒装芯片器件连接到衬底的自动化方法

摘要：

Apparatus and method for attaching, assembling, and/or mounting a substrate to any semiconductor device or a flip-chip type semiconductor device.

摘要（中）：

用于将衬底附接，组装和/或安装到任何半导体器件或倒装芯片型半导体器件的装置和方法。

公开/授权文献

信息查询

Espacenet