公开(公告)号：US20080048316A1

公开(公告)日：2008-02-28

申请号：US11509990

申请日：2006-08-25

Applicant: Stuart L. Roberts ,  Tracy V. Reynolds ,  Rich Fogal ,  Matt E. Schwab

Inventor： Stuart L. Roberts ,  Tracy V. Reynolds ,  Rich Fogal ,  Matt E. Schwab

IPC: H01L23/48

CPC classification number: H01L23/538 ,  H01L21/50 ,  H01L23/3121 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/8183 ,  H01L2224/8383 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/13099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: Microdevices and methods for packaging microdevices. One embodiment of a packaged microdevice includes a substrate having a mounting area, contacts in the mounting area, and external connectors electrically coupled to corresponding contacts. The microdevice also includes a die located across from the mounting area and spaced apart from the substrate by a gap. The die has an integrated circuit and pads electrically coupled to the integrated circuit. The microdevice further includes first and second conductive elements in the gap that form interconnects between the contacts of the substrate and corresponding pads of the die. The first conductive elements are electrically connected to contacts on the substrate, and the second conductive elements are electrically coupled to corresponding pads of the die. The first conductive elements are attached to the second conductive elements at corresponding interfaces such that the interconnects connect the contacts of the substrate directly to corresponding pads on the die within the gap.

Abstract translation: 微型设备的微型设备和方法。 封装的微型器件的一个实施例包括具有安装区域的基板，安装区域中的触点和电耦合到相应触点的外部连接器。 微型装置还包括位于安装区域两侧的模具，并与基板间隔开间隙。 芯片具有集成电路和电耦合到集成电路的焊盘。 微型器件还包括在间隙中的第一和第二导电元件，其形成衬底的触点和芯片的相应焊盘之间的互连。 第一导电元件电连接到衬底上的触点，并且第二导电元件电耦合到管芯的相应焊盘。 第一导电元件在对应的接口处附接到第二导电元件，使得互连将衬底的触点直接连接到间隙内的芯片上的相应焊盘。

公开(公告)号：US20050029329A1

公开(公告)日：2005-02-10

申请号：US10635947

申请日：2003-08-06

Applicant: Stuart Roberts ,  Rich Fogal

Inventor： Stuart Roberts ,  Rich Fogal

IPC: B23K20/00 ,  H01L21/60 ,  H01L23/13 ,  B23K1/06

CPC classification number: H01L24/85 ,  B23K20/005 ,  H01L23/13 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/4824 ,  H01L2224/48463 ,  H01L2224/48472 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00

Abstract: Wire bonders and methods of wire-bonding are disclosed herein. In one embodiment, a method includes attaching a wire to a terminal of a microelectronic component and generating an arc between a first electrode and a second electrode to sever the wire at a point at least proximate to the first and second electrodes. In another embodiment, a wire bonder includes a bond head having a capillary, a first electrode and a second electrode each disposed relative to the bond head, and a controller operably coupled to the first and second electrodes. The controller has a computer-readable medium containing instructions to perform the above-mentioned method. It is emphasized that this Abstract is provided to comply with the rules requiring an abstract. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

Abstract translation: 引线接合器和引线接合方法在本文中公开。 在一个实施例中，一种方法包括将导线附接到微电子部件的端子并且在第一电极和第二电极之间产生电弧，以在至少接近第一和第二电极的点处切断电线。 在另一个实施例中，引线接合器包括具有毛细管，第一电极和第二电极的接合头，每个第一电极和第二电极相对于接合头设置，以及可操作地耦合到第一和第二电极的控制器。 控制器具有包含执行上述方法的指令的计算机可读介质。 要强调的是提供本摘要以符合要求摘要的规则。 提交它的理解是，它不会用于解释或限制权利要求的范围或含义。

公开(公告)号：US06793749B2

公开(公告)日：2004-09-21

申请号：US10357631

申请日：2003-02-03

Applicant: Rich Fogal ,  John VanNortwick ,  Chad A. Cobbley

Inventor： Rich Fogal ,  John VanNortwick ,  Chad A. Cobbley

IPC: B32B3100

CPC classification number: H01L21/67259 ,  H01L21/67144 ,  H01L21/6838 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/78 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/14 ,  Y10T156/1089 ,  Y10T156/109 ,  Y10T156/1702 ,  Y10T156/1744 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: Apparatus and method for attaching, assembling, and/or mounting a substrate to any semiconductor device or a flip-chip type semiconductor device.

Abstract translation: 用于将衬底附接，组装和/或安装到任何半导体器件或倒装芯片型半导体器件的装置和方法。

公开(公告)号：US06607121B2

公开(公告)日：2003-08-19

申请号：US10139430

申请日：2002-05-06

Applicant: Rich Fogal ,  Michael B. Ball ,  Ronald W. Ellis

Inventor： Rich Fogal ,  Michael B. Ball ,  Ronald W. Ellis

IPC: B23K3102

CPC classification number: H01L24/78 ,  B23K20/004 ,  B23K37/0426 ,  B23K2101/40 ,  H01L2224/78 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2224/48 ,  H01L2224/45099

Abstract: A precisor plate for an automatic wire bonder having a heat block attachment portion thereon to precisely attach a heat block thereto provides a simple and quickly adjustable precisor plate and method of alignment. The precisor plate includes fixed alignment pins to align the precisor plate relative to a lead frame in an automatic wire bonding machine. In a preferred embodiment, the heat block is integral with the precisor plate and includes internal bores and or passageways for receiving a heating element, a thermocouple, and/or a vacuum source.

公开(公告)号：US06334566B1

公开(公告)日：2002-01-01

申请号：US09702568

申请日：2000-10-31

Applicant: Michael B. Ball ,  Rich Fogal

Inventor： Michael B. Ball ,  Rich Fogal

IPC: B23K3704

CPC classification number: H01L24/85 ,  B23K3/0623 ,  B23K20/004 ,  B23K2101/40 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A wire-bonding machine includes a heat block for supporting a lead frame during wire-bonding. A clamp mechanism in the machine clamps leads of the lead frame during wire-bonding by fixedly holding sets of the leads against the heat block one set at a time. A wire-bonding tool wire-bonds leads clamped by the clamp mechanism to bond pads on an integrated circuit die. By clamping leads of the lead frame in separate sets, the machine provides improved clamping for lead frames with leads requiring clamping in different planes.

公开(公告)号：US06237830B1

公开(公告)日：2001-05-29

申请号：US09333080

申请日：1999-06-14

Applicant: Rich Fogal ,  Michael B. Ball ,  Ronald W. Ellis

Inventor： Rich Fogal ,  Michael B. Ball ,  Ronald W. Ellis

IPC: B23K3704

CPC classification number: H01L24/78 ,  B23K20/004 ,  B23K37/0426 ,  B23K2101/40 ,  H01L2224/78 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2224/48 ,  H01L2224/45099

Abstract: A precisor plate for an automatic wire bonder having a heat block attachment portion thereon to precisely attach a heat block thereto provides a simple and quickly adjustable precisor plate and method of alignment. The precisor plate includes fixed alignment pins to align the precisor plate relative to a lead frame in an automatic wire bonding machine. In a preferred embodiment, the heat block is integral with the precisor plate and includes internal bores and or passageways for receiving a heating element, a thermocouple, and/or a vacuum source.

Abstract translation: 一种用于自动焊线机的精密板，其上具有用于精确地附接热块的热块连接部分，其提供简单且快速可调的精准板和对准方法。 精密板包括固定的对准销，以在自动引线接合机中相对于引线框架对准精准板。 在优选实施例中，热块与精密板是一体的，并且包括用于接收加热元件，热电偶和/或真空源的内孔和/或通道。

公开(公告)号：US06223967B1

公开(公告)日：2001-05-01

申请号：US09241467

申请日：1999-02-01

Applicant: Rich Fogal ,  Michael B. Ball

Inventor： Rich Fogal ,  Michael B. Ball

IPC: B23K2000

CPC classification number: H01L24/85 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/7825 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85201 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/00014

Abstract: An extended travel wire bonding machine that includes a first positioning table movable along an X axis in a first horizontal plane, a second positioning table movable along X and Y axes in a second horizontal plane, the second positioning table being supported on the first positioning table, and a bond head supported on the second positioning table. The wire bonding machine may also include a bonding tool attached to the bond head and a carrier for supporting the leadframe strip under the bonding tool. The first positioning table is moveable for substantially the entire length of the leadframe strip to allow the bonding tool to be successively moved over each semiconductor die on the leadframe strip.

Abstract translation: 一种延长移动线接合机，包括：沿第一水平面的X轴移动的第一定位台，沿着X轴和Y轴在第二水平面移动的第二定位台，所述第二定位台支撑在所述第一定位台 以及支撑在第二定位台上的结合头。 引线接合机还可以包括连接到接合头的接合工具和用于在接合工具下支撑引线框条的载体。 第一定位台可基本上移动引导框架条的整个长度，以允许接合工具在引线框条上的每个半导体管芯上连续地移动。

公开(公告)号：US6068174A

公开(公告)日：2000-05-30

申请号：US763366

申请日：1996-12-13

Applicant: Michael B. Ball ,  Rich Fogal

Inventor： Michael B. Ball ,  Rich Fogal

IPC: B23K3/06 ,  B23K20/00 ,  H01L21/607 ,  H01L21/60 ,  B23K37/04

CPC classification number: H01L24/85 ,  B23K20/004 ,  B23K3/0623 ,  B23K2201/40 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14

Abstract: A wire-bonding machine includes a heat block for supporting a lead frame during wire-bonding. A clamp mechanism in the machine clamps leads of the lead frame during wire-bonding by fixedly holding sets of the leads against the heat block one set at a time. A wire-bonding tool wire-bonds leads clamped by the clamp mechanism to bond pads on an integrated circuit die. By clamping leads of the lead frame in separate sets, the machine provides improved clamping for lead frames with leads requiring clamping in different planes.

公开(公告)号：US07868440B2

公开(公告)日：2011-01-11

申请号：US11509990

申请日：2006-08-25

Applicant: Stuart L. Roberts ,  Tracy V. Reynolds ,  Rich Fogal ,  Matt E. Schwab

Inventor： Stuart L. Roberts ,  Tracy V. Reynolds ,  Rich Fogal ,  Matt E. Schwab

IPC: H01L23/02 ,  H01L23/04 ,  H01L23/12

CPC classification number: H01L23/538 ,  H01L21/50 ,  H01L23/3121 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/8183 ,  H01L2224/8383 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/13099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: Microdevices and methods for packaging microdevices. One embodiment of a packaged microdevice includes a substrate having a mounting area, contacts in the mounting area, and external connectors electrically coupled to corresponding contacts. The microdevice also includes a die located across from the mounting area and spaced apart from the substrate by a gap. The die has an integrated circuit and pads electrically coupled to the integrated circuit. The microdevice further includes first and second conductive elements in the gap that form interconnects between the contacts of the substrate and corresponding pads of the die. The first conductive elements are electrically connected to contacts on the substrate, and the second conductive elements are electrically coupled to corresponding pads of the die. The first conductive elements are attached to the second conductive elements at corresponding interfaces such that the interconnects connect the contacts of the substrate directly to corresponding pads on the die within the gap.

Abstract translation: 微型设备的微型设备和方法。 封装的微型器件的一个实施例包括具有安装区域的基板，安装区域中的触点和电耦合到相应触点的外部连接器。 微型装置还包括位于安装区域两侧的模具，并与基板间隔开间隙。 芯片具有集成电路和电耦合到集成电路的焊盘。 微型器件还包括在间隙中的第一和第二导电元件，其形成衬底的触点和芯片的相应焊盘之间的互连。 第一导电元件电连接到衬底上的触点，并且第二导电元件电耦合到管芯的相应焊盘。 第一导电元件在对应的接口处附接到第二导电元件，使得互连将衬底的触点直接连接到间隙内的芯片上的相应焊盘。

公开(公告)号：US06991970B2

公开(公告)日：2006-01-31

申请号：US09945084

申请日：2001-08-30

Applicant: Rich Fogal ,  Tracy Reynolds ,  Timothy Cowles

Inventor： Rich Fogal ,  Tracy Reynolds ,  Timothy Cowles

IPC: H01L21/82

CPC classification number: H01L23/525 ,  G11C17/16 ,  G11C29/028 ,  G11C29/88 ,  G11C29/883 ,  H01L21/76892 ,  H01L22/32 ,  H01L24/05 ,  H01L24/06 ,  H01L2224/05578 ,  H01L2224/13028 ,  H01L2224/1613 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19041

Abstract: A method used to form a semiconductor device comprises providing first and second circuit portions having first and second pad portions respectively. The second circuit portion is electrically isolated from the first circuit portion. The first and second pad portions are then electrically connected, for example with a ball bond or a wire bond, to electrically couple the first and second circuit portions. In various embodiments the semiconductor device will not function until the pad portions are electrically coupled, and in other embodiments the functionality of the device may be selectively controlled by connecting selected pad portions from a plurality of pad portions. Isolating the first and second circuit portions allows electrical operations such as antifuse programming to be carried out without adversely affecting related circuits. Once electrical operations are completed, the isolated circuit portions are electrically coupled to provide a complete circuit. Various inventive embodiments and implementations are described.