发明授权
US06773573B2 Plating bath and method for depositing a metal layer on a substrate
有权
电镀浴和在基板上沉积金属层的方法
- 专利标题: Plating bath and method for depositing a metal layer on a substrate
- 专利标题(中): 电镀浴和在基板上沉积金属层的方法
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申请号: US09970224申请日: 2001-10-02
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公开(公告)号: US06773573B2公开(公告)日: 2004-08-10
- 发明人: David R. Gabe , Andrew J. Cobley , Leon R. Barstad , Mark J. Kapeckas , Erik Reddington , Wade Sonnenberg , Thomas Buckley
- 申请人: David R. Gabe , Andrew J. Cobley , Leon R. Barstad , Mark J. Kapeckas , Erik Reddington , Wade Sonnenberg , Thomas Buckley
- 主分类号: C25D338
- IPC分类号: C25D338
摘要:
A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The alcohol compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the alcohol compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.
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