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公开(公告)号：US07384535B2
公开(公告)日：2008-06-10
申请号：US10831726
申请日：2004-04-24
申请人： Wade Sonnenberg , Leon R. Barstad , Raymond Cruz , Gary Hamm , Mark J. Kapeckas , Erik Reddington , Katie Price , Thomas Buckley , Trevor Goodrich
发明人： Wade Sonnenberg , Leon R. Barstad , Raymond Cruz , Gary Hamm , Mark J. Kapeckas , Erik Reddington , Katie Price , Thomas Buckley , Trevor Goodrich
IPC分类号： G01N27/42
CPC分类号： G01N27/42
摘要： Analytical methods are disclosed for determining the quantity of brightener and leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. The methods improve the reproducibility of measuring brighteners and levelers in electroplating baths.
摘要翻译： 公开了用于在存在其它有机添加剂例如促进剂，增白剂和抑制剂的情况下在电镀浴中测定增白剂和矫味剂的量的分析方法。 该方法提高了电镀浴中测量增白剂和矫光剂的重现性。
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公开(公告)号：US20060151327A1
公开(公告)日：2006-07-13
申请号：US10831761
申请日：2004-04-24
申请人： Wade Sonnenberg , Leon Barstad , Raymond Cruz , Gary Hamm , Mark Kapeckas , Erik Reddington , Katie Price , Thomas Buckley , Trevor Goodrich
发明人： Wade Sonnenberg , Leon Barstad , Raymond Cruz , Gary Hamm , Mark Kapeckas , Erik Reddington , Katie Price , Thomas Buckley , Trevor Goodrich
CPC分类号： C25D21/12 , G01N27/42 , G01N27/423
摘要： Analytical methods are disclosed for determining the quantity of organic components in a bath. The analytical methods work over a broad concentration range of organic components and are sensitive in measuring organic bath components at low concentrations.
摘要翻译： 公开了用于确定浴中的有机组分的量的分析方法。 分析方法在广泛的有机组分浓度范围内工作，并且在低浓度下测量有机浴组分是敏感的。
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公开(公告)号：US06752878B2
公开(公告)日：2004-06-22
申请号：US09956386
申请日：2001-09-19
IPC分类号： C23C2200
摘要： A method for treating a micro-roughened metal surface to improve bonding between the metal surface and a polymer material. The method involves post-treating the micro-roughened conversion coated metal surface with an aqueous wetting agent composition after having formed the micro-roughened conversion coated metal surface with an adhesion promotion composition. The method can be employed in the circuit board industry to improve bonding between layers in multilayer circuit boards.
摘要翻译： 一种用于处理微粗化金属表面以改善金属表面和聚合物材料之间的结合的方法。 该方法包括在用粘附促进组合物形成微粗糙化转化涂覆的金属表面后，用水性润湿剂组合物对微粗糙化转化涂覆的金属表面进行后处理。 该方法可用于电路板工业中以改善多层电路板中的层之间的结合。
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4.发明授权Method for electroplating using stabilized dispersions of conductive particles 失效使用稳定的导电颗粒分散体进行电镀的方法
公开(公告)号：US6039859A
公开(公告)日：2000-03-21
申请号：US82437
申请日：1998-05-20
摘要： The invention relates to a conductive dispersions used for diverse purposes such a base for electroplating nonconductors. The dispersion are characterized by use of a stabilizing quantity of a stabilizer having repeating alylkene oxide groups and a hydrophilic--lipophilic balance in excess of 12. It has been found that the stabilizers utilized in the subject compositions does result in a significant loss of conductivity in coatings formed from the dispersion.
摘要翻译： 本发明涉及用于不同目的的导电分散体，例如用于电镀非导体的基底。 分散体的特征在于使用稳定剂量的具有重复的烯丙基氧基基团和亲水 - 亲油平衡的稳定剂超过12个。已经发现，用于本发明组合物中的稳定剂确实导致显着的导电性损失 由分散体形成的涂层。
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公开(公告)号：US5223118A
公开(公告)日：1993-06-29
申请号：US666798
申请日：1991-03-08
申请人： Wade Sonnenberg , Roger Bernards , Patrick Houle , Gordon Fisher
发明人： Wade Sonnenberg , Roger Bernards , Patrick Houle , Gordon Fisher
IPC分类号： G01N27/416 , C25D21/14 , G01N27/42
摘要： A direct method of analyzing brighteners and levelers used in metal electroplating baths. The method is based on the differential adsorption of these additives on a working electrode during a sequence of steps prior to and during metal plating. The sensitivity of the method allows for the determination of both brightener and leveler in the same sample without cyclic processing.
摘要翻译： 分析金属电镀浴中使用的增白剂和矫直剂的直接方法。 该方法基于在金属电镀之前和期间的一系列步骤期间这些添加剂在工作电极上的差异吸附。 该方法的灵敏度允许在不进行循环处理的同一样品中确定增白剂和均化剂。
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公开(公告)号：US5004525A
公开(公告)日：1991-04-02
申请号：US438020
申请日：1989-11-20
CPC分类号： C25D3/38 , H05K3/42 , H05K2203/162
摘要： A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.
摘要翻译： 一种用于将铜电镀到包含溶液可溶性铜盐和酸性电解质的导电表面上的组合物，所述铜盐以每升溶液约1至10克的浓度存在，并且所述酸以浓度存在，其中酸 铜比优选在约30至1和50至1之间变化。该组合物特别可用于电镀具有至少10比1的高度与直径的比率以及至少0.100英寸的长度的圆柱形开口的壁。
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公开(公告)号：US06773573B2
公开(公告)日：2004-08-10
申请号：US09970224
申请日：2001-10-02
申请人： David R. Gabe , Andrew J. Cobley , Leon R. Barstad , Mark J. Kapeckas , Erik Reddington , Wade Sonnenberg , Thomas Buckley
发明人： David R. Gabe , Andrew J. Cobley , Leon R. Barstad , Mark J. Kapeckas , Erik Reddington , Wade Sonnenberg , Thomas Buckley
IPC分类号： C25D338
摘要： A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The alcohol compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the alcohol compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.
摘要翻译： 含有抑制或延缓电镀浴添加剂消耗的醇化合物的金属电镀液。 添加剂是改善电镀金属的亮度，电镀金属的物理性质，特别是相对于延展性和微投能力以及电镀液的宏投射功率的化学化合物。 抑制或延缓添加剂消耗的酒精化合物会增加镀液的使用寿命，并提高电镀工艺的效率。 可以使用含有抑制或延迟添加剂消耗的醇化合物的电镀浴来镀铜，金，银，钯，铂，钴，镉，铬，铋，铟，铑，钌和铱。
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公开(公告)号：US06652731B2
公开(公告)日：2003-11-25
申请号：US09970271
申请日：2001-10-02
申请人： Andrew J. Cobley , Mark J. Kapeckas , Erik Reddington , Wade Sonnenberg , Leon R. Barstad , Thomas Buckley
发明人： Andrew J. Cobley , Mark J. Kapeckas , Erik Reddington , Wade Sonnenberg , Leon R. Barstad , Thomas Buckley
IPC分类号： C25D338
摘要： A metal plating bath and metal plating process that contains aldehyde compounds that prevent or reduce the consumption of metal plating bath additives. The metal plating baths provide for an efficient plating method because the plating process need not be interrupted to replenish the plating bath with additives. The Metal plating baths may be employed to plate metals such as copper, gold, silver, palladium, cobalt, chromium, cadmium, bismuth, indium, rhodium, iridium, and ruthenium.
摘要翻译： 金属镀液和金属电镀工艺，含有醛类化合物，可防止或减少金属电镀浴添加剂的消耗。 金属电镀浴提供有效的电镀方法，因为不需要中断电镀工艺以补充镀液。 金属镀液可以用于镀铜，金，银，钯，钴，铬，镉，铋，铟，铑，铱和钌等金属。
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9.发明授权Electroplating composition and process for plating through holes in printed circuit boards 失效电镀组合物和电镀印刷电路板上的孔的方法
公开(公告)号：US4897165A
公开(公告)日：1990-01-30
申请号：US235051
申请日：1988-08-23
CPC分类号： C25D3/38 , H05K3/42 , H05K3/423 , H05K2203/162
摘要： A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.Also disclosed is a device for measuring throwing power of a plating solution. The device comprises two anodes and a cathode suspended in a chamber adapted to contain a plating solution. The cathode is suspended between said anodes and comprises two flat electrode portions in electrical contact with each other, in parallel relationship to each other and spaced apart from each other to define a space containing plating solution. Each of said flat electrode portions has electrode portions electrically isolated from a center electrode and means for measuring the current on said first electrode portions and center electrode.
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10.发明授权Conductive polymer colloidal compositions with selectivity for non-conductive surfaces 有权导电聚合物胶体组合物，对非导电表面具有选择性公开(公告)号：US06899829B2
公开(公告)日：2005-05-31
申请号：US09998117
申请日：2001-11-30
摘要： A conductive polymer colloidal composition that selectively forms a coating on a non-conductive surface. The conductive polymer colloidal composition is composed of a polymer and a sulfonate dopant. The conductive polymer colloidal composition may also contain conductive colloidal particles such as conductive carbon or metal salt particles, oxidants, stabilizers, and preservatives. The conductive polymer colloidal composition may be employed to selectively coat the non-conductive parts of printed wiring boards such that a uniform metal layer can be deposited on the conductive polymer coat. In addition to a uniform metal layer being formed over the conductive polymer, adhesion between the metal layer and the printed wiring board is improved.
摘要翻译： 导电聚合物胶体组合物，其选择性地在非导电表面上形成涂层。 导电聚合物胶体组合物由聚合物和磺酸盐掺杂剂组成。 导电聚合物胶体组合物还可以含有导电胶体颗粒，例如导电碳或金属盐颗粒，氧化剂，稳定剂和防腐剂。 可以使用导电聚合物胶体组合物来选择性地涂覆印刷线路板的非导电部分，使得可以在导电聚合物涂层上沉积均匀的金属层。 除了在导电聚合物上形成均匀的金属层之外，还提高了金属层和印刷线路板之间的粘附性。
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