发明授权
US06774047B2 Method of manufacturing a semiconductor integrated circuit device 失效
制造半导体集成电路器件的方法

  • 专利标题: Method of manufacturing a semiconductor integrated circuit device
  • 专利标题(中): 制造半导体集成电路器件的方法
  • 申请号: US09902673
    申请日: 2001-07-12
  • 公开(公告)号: US06774047B2
    公开(公告)日: 2004-08-10
  • 发明人: Michimasa Funabashi
  • 申请人: Michimasa Funabashi
  • 优先权: JP10-257267 19980910
  • 主分类号: H01L21302
  • IPC分类号: H01L21302
Method of manufacturing a semiconductor integrated circuit device
摘要:
A processing solution containing hydrogen peroxide, hydracid fluoride salt, and water is used for pre-cleaning prior to a step of forming a gate oxide film 14 by subjecting a silicon water 1 to a heat treatment. Tetraalkyl ammonium fluoride, ammonium fluoride or the like is used as hydracid fluoride salt.
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