发明授权
- 专利标题： Protected bond fingers
- 专利标题（中）： 受保护的手指
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申请号： US10135547申请日： 2002-04-30
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公开(公告)号： US06774471B2公开(公告)日： 2004-08-10
- 发明人: Choong Kooi Chee
- 申请人： Choong Kooi Chee
- 主分类号： H01I2302
- IPC分类号： H01I2302
摘要：
A package substrate having a finger projection that is either an elevated or removably covered bond finger. The finger portion includes a portion to remain uncovered by a die and an underfill material when the package substrate is coupled to the die. A second portion of the finger projection may allow the first portion to remain uncovered as indicated.
公开/授权文献
- US20030203542A1 Protected bond fingers 公开/授权日：2003-10-30
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