A system for detecting voids in an ILD layer is provided. The system includes one or more light sources, each light source directing light to respective portions of the ILD layer. Light reflected from the respective portions is collected by a measuring system that processes the collected light. The collected light is indicative of the presence of voids in the respective portions of the ILD layer. The measuring system provides ILD layer void related data to a processor that determines whether voids exist in the respective portions of the ILD layer. The processor selectively marks the ILD layer portions to facilitate further processing and/or destruction of the IC with the ILD layer voids.