发明授权
- 专利标题: BiCMOS integration scheme with raised extrinsic base
- 专利标题(中): BiCMOS整合方案具有突出的外在基础
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申请号: US10249563申请日: 2003-04-18
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公开(公告)号: US06780695B1公开(公告)日: 2004-08-24
- 发明人: Huajie Chen , Seshadri Subbanna , Basanth Jagannathan , Gregory G. Freeman , David C. Ahlgren , David Angell , Kathryn T. Schonenberg , Kenneth J. Stein , Fen F. Jamin
- 申请人: Huajie Chen , Seshadri Subbanna , Basanth Jagannathan , Gregory G. Freeman , David C. Ahlgren , David Angell , Kathryn T. Schonenberg , Kenneth J. Stein , Fen F. Jamin
- 主分类号: H01L218238
- IPC分类号: H01L218238
摘要:
A method of forming a BiCMOS integrated circuit having a raised extrinsic base is provided. The method includes first forming a polysilicon layer atop a surface of a gate dielectric which is located atop a substrate having device areas for forming at least one bipolar transistor and device areas for forming at least one complementary metal oxide semiconductor (CMOS) transistor. The polysilicon layer is then patterned to provide a sacrificial polysilicon layer over the device areas for forming the at least one bipolar transistor and its surrounding areas, while simultaneously providing at least one gate conductor in the device areas for forming at least one CMOS transistor. At least one pair of spacers are then formed about each of the at least one gate conductor and then a portion of the sacrificial polysilicon layer over the bipolar device areas are selectively removed to provide at least one opening in the bipolar device area. At least one bipolar transistor having a raised extrinsic base is then formed in the at least one opening.
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