发明授权
US06790682B2 Die bonder for die-bonding a semiconductor chip to lead frame and method of producing a semiconductor device using the die bonder
失效
用于将半导体芯片芯片接合到引线框的芯片接合器和使用该芯片焊接机制造半导体器件的方法
- 专利标题： Die bonder for die-bonding a semiconductor chip to lead frame and method of producing a semiconductor device using the die bonder
- 专利标题（中）： 用于将半导体芯片芯片接合到引线框的芯片接合器和使用该芯片焊接机制造半导体器件的方法
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申请号： US10199015申请日： 2002-07-22
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公开(公告)号： US06790682B2公开(公告)日： 2004-09-14
- 发明人: Susumu Fujiwara
- 申请人： Susumu Fujiwara
- 优先权： JP2001-221456 20010723
- 主分类号： H01L2100
- IPC分类号： H01L2100
摘要：
To provide increased yields of semiconductor devices to achieve efficient production there are provided a storage correlating and storing inspection data of each of a plurality of semiconductor chips formed in a wafer and the position of each of a plurality of triac chips as seen on the wafer, a wafer screening portion referring to the inspection data of the semiconductor chips in the storage to select a wafer from a plurality of wafers, and a die-bonding portion die-bonding a triac chip formed in the selected wafer to a lead frame of a high rank semiconductor device having a superior characteristic.
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