发明授权
US06791192B2 Multiple chips bonded to packaging structure with low noise and multiple selectable functions
有权
多个芯片结合到具有低噪声和多种可选功能的封装结构
- 专利标题： Multiple chips bonded to packaging structure with low noise and multiple selectable functions
- 专利标题（中）： 多个芯片结合到具有低噪声和多种可选功能的封装结构
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申请号： US10371506申请日： 2003-02-21
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公开(公告)号： US06791192B2公开(公告)日： 2004-09-14
- 发明人: Mou-Shiung Lin , Bryan Peng
- 申请人： Mou-Shiung Lin , Bryan Peng
- 主分类号： H01L2324
- IPC分类号： H01L2324
摘要：
A chip package for semiconductor chips is provided by the method of forming a chip package includes the steps of forming a printed circuit board with a window therethrough; forming semiconductor chip connections of one or more primary chips which overlie the window to the printed circuit board by solder connections, locating a suspended semiconductor chip within the window, and connecting the suspended semiconductor chip to one or more primary chips overlying the window in a chip-on-chip connection. A bypass capacitor is formed on the printed circuit board.