公开(公告)号：US06734542B2

公开(公告)日：2004-05-11

申请号：US10033322

申请日：2001-12-27

申请人： Seiichi Nakatani ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Shingo Komatsu

发明人： Seiichi Nakatani ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Shingo Komatsu

IPC分类号： H01L2324

CPC分类号： H05K1/187 ,  H01L21/4857 ,  H01L23/49816 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5389 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/188 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/10378 ,  H05K2203/061 ,  Y10S438/977 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/0401

摘要： A component built-in module including a core layer formed of an electric insulating material, and an electric insulating layer and a plurality of wiring patterns, which are formed on at least one surface of the core layer. The electric insulating material of the core layer is formed of a mixture including at least an inorganic filler and a thermosetting resin. At least one or more of active components and/or passive components are contained in an internal portion of the core layer. The core layer has a plurality of wiring patterns and a plurality of inner vias formed of a conductive resin. The electric insulating material formed of the mixture including at least an inorganic filler and a thermosetting resin of the core layer has a modulus of elasticity at room temperature in the range from 0.6 GPa to 10 GPa. Thus, it is possible to provide a thermal conductive component built-in module capable of filling the inorganic filler with high density; burying the active component such as a semiconductor etc. and the passive component such as a chip resistor, a chip capacitor, etc. in the internal portion of the substrate; and simply producing a multilayer wiring structure.

公开(公告)号：US06531768B2

公开(公告)日：2003-03-11

申请号：US09951981

申请日：2001-09-14

申请人： Toshio Miyamoto

发明人： Toshio Miyamoto

IPC分类号： H01L2324

CPC分类号： H01L21/2885 ,  H01L21/288 ,  H01L21/76802 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/02166 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/13016 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/1369 ,  H01L2224/16105 ,  H01L2224/45124 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01056 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/48

摘要： A laser beam is irradiated onto a photocurable resin layer formed on an electrode part before rearrangement. By scanning the resin on the periphery of a metal wiring formation area extending from the electrode part before rearrangement to a bump electrode contact area, is cured. As a result, a cured resin part is formed which works as a guide layer and a protection film for protecting the metal wire in which the metal wiring formation area has a hollow shape. Thereafter, the metal wire is formed inside the cured resin part.

摘要翻译： 在重排之前，将激光束照射到形成在电极部上的光固化树脂层上。 通过扫描在重排之前从电极部分延伸到凸块电极接触区域的金属布线形成区域的周边上的树脂被固化。 结果，形成了用作引导层的固化树脂部分和用于保护金属布线形成区域具有中空形状的金属线的保护膜。 此后，金属线形成在固化树脂部分的内部。

公开(公告)号：US06784540B2

公开(公告)日：2004-08-31

申请号：US10267142

申请日：2002-10-08

申请人： Charles S. Cardwell

发明人： Charles S. Cardwell

IPC分类号： H01L2324

CPC分类号： H01L23/492 ,  H01L23/3114 ,  H01L23/3185 ,  H01L23/3675 ,  H01L23/3733 ,  H01L23/4334 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L2224/0401 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/73153 ,  H01L2224/73253 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/16152 ,  H01L2924/167 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00

摘要： A chip scale package has a semiconductor MOSFET die which has a top electrode surface covered with a layer of a photosensitive liquid epoxy which is photolithographically patterned to expose portions of the electrode surface and to act as a passivation layer and as a solder mask. A solderable contact layer is then formed over the passivation layer. The individual die are mounted drain side down in a metal clip or can with the drain electrode disposed coplanar with a flange extending from the can bottom. The metal clip or drain clip has a plurality, a parallel spaced fins extending from its outwardly facing surface.

摘要翻译： 芯片级封装具有半导体MOSFET管芯，其具有覆盖有感光性液体环氧树脂层的顶部电极表面，该层被光刻图案化以暴露电极表面的部分并且用作钝化层和作为焊接掩模。 然后在钝化层上形成可焊接接触层。 单个管芯的排水侧面向下安装在金属夹子或罐中，其中漏电极设置为与罐底部延伸的凸缘共面。 金属夹子或排水夹具有从其向外的表面延伸的多个平行间隔的翅片。

公开(公告)号：US06713859B1

公开(公告)日：2004-03-30

申请号：US09660757

申请日：2000-09-13

申请人： Qing Ma

发明人： Qing Ma

IPC分类号： H01L2324

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/5389 ,  H01L23/564 ,  H01L24/19 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/13022 ,  H01L2224/16225 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2224/82 ,  H01L2224/05552 ,  H01L2924/00

摘要： A packaging technology that fabricates a microelectronic package including build-up layers, having conductive traces, on an encapsulated microelectronic die and on other packaging material that surrounds the microelectronic die, wherein an moisture barrier structure is simultaneously formed with the conductive traces. An exemplary microelectronic package includes a microelectronic die having an active surface and at least one side. Packaging material(s) is disposed adjacent the microelectronic die side(s), wherein the packaging material includes at least one surface substantially planar to the microelectronic die active surface. A first dielectric material layer may be disposed on at least a portion of the microelectronic die active surface and the encapsulation material surface. At least one conductive trace is then formed on the first dielectric material layer to electrically contact the microelectronic die active surface. A barrier structure proximate an edge of the microelectronic package is formed simultaneously out of the same material as the conductive traces.

摘要翻译： 一种封装技术，其在封装的微电子管芯和围绕微电子管芯的其它包装材料上制造包括具有导电迹线的堆积层的微电子封装，其中与导电迹线同时形成防潮结构。 示例性的微电子封装包括具有活性表面和至少一个侧面的微电子管芯。 包装材料邻近微电子管芯侧设置，其中包装材料包括至少一个与微电子管芯有效表面平坦的表面。 第一介电材料层可以设置在微电子管芯有源表面和封装材料表面的至少一部分上。 然后在第一介电材料层上形成至少一个导电迹线以电接触微电子管芯有源表面。 靠近微电子封装边缘的屏障结构与导电迹线相同的材料同时形成。

公开(公告)号：US06667548B2

公开(公告)日：2003-12-23

申请号：US09828617

申请日：2001-04-06

申请人： Michael O'Connor ,  Kevin J. Haley ,  Biswajit Sur

发明人： Michael O'Connor ,  Kevin J. Haley ,  Biswajit Sur

IPC分类号： H01L2324

CPC分类号： H01L23/3735 ,  H01L23/3732 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/10253 ,  Y10S257/93 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor chip is shown containing an integral heat spreading layer that more effectively transmits heat from the die to ambient as a result of spreading the heat out on the die over a larger cross sectional area. Local hot spots are minimized which allows the semiconductor chip to operate at a higher frequency for a given upper threshold temperature. Also shown is a method of manufacturing such a semiconductor chip, and the associated method of cooling a semiconductor chip.

公开(公告)号：US06809261B1

公开(公告)日：2004-10-26

申请号：US10602418

申请日：2003-06-23

申请人： Kee Y an Ng ,  Cheng Why Tan ,  Ji Kin Tham

发明人： Kee Y an Ng ,  Cheng Why Tan ,  Ji Kin Tham

IPC分类号： H01L2324

CPC分类号： H01L23/49861 ,  H01L23/13 ,  H01L23/36 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A device package has a conductive substrate with at least one mounting site, and an insulating substrate with a first side on the side of the conductive substrate with the one or more mounting sites. The insulating substrate has at least one aperture providing access between a second side of the insulating substrate and the one or more mounting sites. The insulating substrate has one or more signal paths on the second side that couple the one or more apertures to one or more contact sites disposed about the insulating substrate. A series of conductive tabs is coupled to corresponding contact sites.

摘要翻译： 器件封装具有至少一个安装位置的导电衬底和具有一个或多个安装位置的导电衬底侧上的第一侧的绝缘衬底。 绝缘基板具有至少一个孔，其提供在绝缘基板的第二侧与一个或多个安装位置之间的通路。 绝缘衬底在第二侧上具有一个或多个信号路径，其将一个或多个孔耦合到围绕绝缘衬底设置的一个或多个接触位置。 一系列导电片连接到相应的接触部位。

公开(公告)号：US06791192B2

公开(公告)日：2004-09-14

申请号：US10371506

申请日：2003-02-21

申请人： Mou-Shiung Lin ,  Bryan Peng

发明人： Mou-Shiung Lin ,  Bryan Peng

IPC分类号： H01L2324

CPC分类号： H05K1/0231 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/0298 ,  H05K1/141 ,  H05K2201/09309 ,  H05K2201/10674 ,  H01L2224/05599

摘要： A chip package for semiconductor chips is provided by the method of forming a chip package includes the steps of forming a printed circuit board with a window therethrough; forming semiconductor chip connections of one or more primary chips which overlie the window to the printed circuit board by solder connections, locating a suspended semiconductor chip within the window, and connecting the suspended semiconductor chip to one or more primary chips overlying the window in a chip-on-chip connection. A bypass capacitor is formed on the printed circuit board.

摘要翻译： 通过形成芯片封装的方法提供用于半导体芯片的芯片封装，包括以下步骤：形成具有窗口的印刷电路板; 通过焊接连接将一个或多个覆盖在窗口上的初级芯片的半导体芯片连接到印刷电路板上，将悬挂的半导体芯片定位在窗口内，以及将悬挂的半导体芯片连接到芯片上的一个或多个覆盖窗口的主要芯片 - 芯片连接。 在印刷电路板上形成旁路电容器。

公开(公告)号：US06245596B1

公开(公告)日：2001-06-12

申请号：US09427584

申请日：1999-10-27

申请人： Katsuya Kosaki ,  Masahiro Tamaki ,  Hiroshi Matsuoka

发明人： Katsuya Kosaki ,  Masahiro Tamaki ,  Hiroshi Matsuoka

IPC分类号： H01L2324

CPC分类号： H01L21/78 ,  H01L23/3677 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of producing a semiconductor device having a heat dissipating metal layer wherein the number of patterning steps is reduced, laser dicing produces a better profile, and first and second metal layers are prevented from separating from each other, and a semiconductor device produced by the method. The number of patterning steps is reduced by employing a flat exposure step for photoresist with mask alignment. A better appearance is obtained by forming the metal layers which connect the semiconductor devices with each other from a first metal layer having a lower melting point and a second metal layer having a higher melting point and severing the first metal layer and the second metal layer successively, from the first metal layer side. A second metal layer is prevented from peeling by preventing oxidation of the plated feeder layer through plating of the second metal layer.

摘要翻译： 一种制造具有散热金属层的半导体器件的方法，其中图案化步骤的数量减少，激光切割产生更好的轮廓，并且防止第一和第二金属层彼此分离，并且制造由 方法。 通过对具有掩模对准的光致抗蚀剂采用平坦曝光步骤来减少图案化步骤的数量。 通过形成从具有较低熔点的第一金属层和具有较高熔点的第二金属层彼此连接半导体器件的金属层，并且连续切断第一金属层和第二金属层而获得更好的外观 ，从第一金属层侧。 通过第二金属层的镀覆防止电镀料层的氧化，防止第二金属层剥离。

公开(公告)号：US06800936B2

公开(公告)日：2004-10-05

申请号：US10332015

申请日：2003-01-03

申请人： Takahiko Kosemura ,  Akihiko Okubora ,  Takayuki Hirabayashi ,  Tatsuya Ogino ,  Kuniyuki Hayashi

发明人： Takahiko Kosemura ,  Akihiko Okubora ,  Takayuki Hirabayashi ,  Tatsuya Ogino ,  Kuniyuki Hayashi

IPC分类号： H01L2324

CPC分类号： H01L23/66 ,  H01F17/0006 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01087 ,  H05K1/165 ,  H05K3/4602 ,  H05K3/4664 ,  H05K3/467 ,  H05K2201/0195 ,  H05K2201/09881

摘要： The present invention provides a high-frequency module configuring a micro communication functional module, which includes a base substrate (2) which has multiple pattern wiring layers (6a) (6b) (9a) (9b) and dielectric insulating layers (5) (8) (11) formed therein, and has a buildup surface for smoothing the upper layer thereof, and a high-frequency element layer (4) formed on the buildup surface, which has an inductor (20) formed therein via an insulating layer (19) formed on the buildup surface. The base substrate (2) is provided with a region (30) where the pattern wiring layers (6a) (6b) (9a) (9b) are not formed from the upper layer to at least the mid portion thereof along the thickness direction, and the inductor (20) of the high-frequency element layer (4) is formed directly above the region (30).

摘要翻译： 本发明提供构成微通信功能模块的高频模块，其包括具有多个图案布线层（6a）（6b）（9a）（9b）和介电绝缘层（5）的基底（2） 8）（11），并且具有用于使其上层平坦化的积层表面和形成在积累表面上的高频元件层（4），该高频元件层（4）具有经由绝缘层形成在其中的电感器（20） 19）形成在积聚表面上。 基底基板（2）具有区域（30），其中图形布线层（6a）（6b）（9a）（9b））不沿着厚度方向至少至少其中间部分形成， 并且高频元件层（4）的电感器（20）直接形成在区域（30）的正上方。

公开(公告)号：US06787893B2

公开(公告)日：2004-09-07

申请号：US10203629

申请日：2002-08-19

申请人： Dai Nakajima ,  Naoki Yoshimatsu ,  Haruyuki Matsuo ,  Ryuuichi Ishii

发明人： Dai Nakajima ,  Naoki Yoshimatsu ,  Haruyuki Matsuo ,  Ryuuichi Ishii

IPC分类号： H01L2324

CPC分类号： H01L23/3735 ,  H01L23/16 ,  H01L23/24 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/4899 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A semiconductor device of the invention comprises a semiconductor element provided within a housing, a bonding wire, a sealing resin member covering the semiconductor element and bonding wire, and a sheet member. The sheet member is fixed in the housing and arranged out of contact with the bonding wire, and moreover buried in the sealing resin member. Because the sheet member restrains the sealing resin member from vibrating, the bonding wire is connected with improved reliability. In place of the sheet member, it is possible to use a pillar member fixed on an insulating substrate. The semiconductor device is suitable for use on a mobile body, such as a vehicle, which proceeds with vibrations.

摘要翻译： 本发明的半导体器件包括设置在壳体内的半导体元件，接合线，覆盖半导体元件和接合线的密封树脂构件和片构件。 片材固定在壳体中并布置成与接合线不接触，并且还被埋在密封树脂构件中。 由于片材构件限制密封树脂构件的振动，所以接合线的可靠性提高。 代替片状部件，可以使用固定在绝缘基板上的支柱部件。 该半导体器件适合于在诸如车辆的移动体上使用，其随着振动而进行。