Invention Grant
- Patent Title: Apparatus, system, and method of determining loading characteristics on an integrated circuit module
- Patent Title (中): 确定集成电路模块上负载特性的装置,系统和方法
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Application No.: US10286193Application Date: 2002-11-01
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Publication No.: US06792375B2Publication Date: 2004-09-14
- Inventor: John Lee Colbert , John Saunders Corbin, Jr. , Roger Duane Hamilton , Arvind Kumar Sinha
- Applicant: John Lee Colbert , John Saunders Corbin, Jr. , Roger Duane Hamilton , Arvind Kumar Sinha
- Main IPC: G06F1900
- IPC: G06F1900

Abstract:
A portable testing apparatus operable with a force applying apparatus for testing loading characteristics on an integrated circuit assembly coupled to a circuit board. Included is a housing assembly having a size and shape to simulate an integrated circuit assembly to be tested; a loading element coupled for movement relative to the housing assembly and engageable with a load detecting system for transferring forces thereto in response to forces applied by a force applying apparatus; an interposer which mates the housing assembly to a circuit board; and, a load detecting system associated with the housing assembly for providing signals representative of characteristics of loading forces applied thereto by a force applying apparatus, whereby the load delivery characteristics of a force applying apparatus can be determined. A method of testing is also provided.
Public/Granted literature
- US20040088121A1 Apparatus, system, and method of determining loading characteristics on an integrated circuit module Public/Granted day:2004-05-06
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